BUK7628-100A,118 NXP Semiconductors, BUK7628-100A,118 Datasheet - Page 6

MOSFET N-CH 100V 47A SOT404

BUK7628-100A,118

Manufacturer Part Number
BUK7628-100A,118
Description
MOSFET N-CH 100V 47A SOT404
Manufacturer
NXP Semiconductors
Series
TrenchMOS™r
Datasheets

Specifications of BUK7628-100A,118

Package / Case
D²Pak, TO-263 (2 leads + tab)
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
28 mOhm @ 25A, 10V
Drain To Source Voltage (vdss)
100V
Current - Continuous Drain (id) @ 25° C
47A
Vgs(th) (max) @ Id
4V @ 1mA
Input Capacitance (ciss) @ Vds
3100pF @ 25V
Power - Max
166W
Mounting Type
Surface Mount
Minimum Operating Temperature
- 55 C
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.028 Ohm @ 10 V
Drain-source Breakdown Voltage
100 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
47 A
Power Dissipation
166000 mW
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Gate Charge (qg) @ Vgs
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
934055882118
BUK7628-100A /T3
BUK7628-100A /T3

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BUK7628-100A,118
Manufacturer:
NEXPERIA/安世
Quantity:
20 000
NXP Semiconductors
6. Characteristics
Table 6.
BUK7628-100A
Product data sheet
Symbol
Static characteristics
V
V
I
I
R
Dynamic characteristics
C
C
C
t
t
t
t
L
L
Source-drain diode
V
t
Q
DSS
GSS
d(on)
r
d(off)
f
rr
D
S
(BR)DSS
GS(th)
SD
DSon
iss
oss
rss
r
Characteristics
Parameter
drain-source
breakdown voltage
gate-source threshold
voltage
drain leakage current
gate leakage current
drain-source on-state
resistance
input capacitance
output capacitance
reverse transfer
capacitance
turn-on delay time
rise time
turn-off delay time
fall time
internal drain
inductance
internal source
inductance
source-drain voltage
reverse recovery time
recovered charge
Conditions
I
I
I
I
I
V
V
V
V
V
V
V
T
V
R
V
R
from upper edge of drain tab to centre of
die; T
from drain lead 6 mm from package to
centre of die; T
from source lead to source bond pad;
T
I
I
I
V
All information provided in this document is subject to legal disclaimers.
D
D
D
D
D
S
S
S
j
j
DS
DS
GS
GS
GS
GS
GS
DS
DS
GS
G(ext)
G(ext)
= 25 °C
= 25 °C
= 25 A; V
= 47 A; V
= 47 A; dI
= 0.25 mA; V
= 0.25 mA; V
= 1 mA; V
= 1 mA; V
= 1 mA; V
= 100 V; V
= 100 V; V
= 30 V; R
= 30 V; R
= 20 V; V
= -20 V; V
= 10 V; I
= 10 V; I
= 0 V; V
= -10 V; V
j
= 25 °C
= 10 Ω; T
10 Ω; T
Rev. 2 — 26 April 2011
GS
GS
S
DS
DS
DS
DS
D
D
/dt = -100 A/µs;
DS
L
L
DS
DS
= 25 A; T
= 25 A; T
= 0 V; T
= 0 V; T
GS
GS
j
j
= V
= V
= V
= 1.2 Ω; V
= 1.2 Ω; V
GS
GS
= 25 V; f = 1 MHz;
= 25 °C
= 25 °C
j
= 0 V; T
= 25 °C
= 0 V; T
= 30 V; T
= 0 V; T
= 0 V; T
= 0 V; T
= 0 V; T
GS
GS
GS
; T
; T
; T
j
j
= 25 °C
= 25 °C
j
j
j
j
j
j
= 25 °C
= -55 °C
= 175 °C
= 175 °C
= 25 °C
j
GS
GS
= 25 °C
j
j
= 25 °C
j
j
j
= 175 °C
= 25 °C
= 25 °C
= -55 °C
= 25 °C
= 10 V;
= 10 V;
N-channel TrenchMOS standard level FET
BUK7628-100A
Min
100
89
2
-
1
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Typ
-
-
3
-
-
-
0.05
2
2
-
20
2320
315
187
15
70
83
45
2.5
4.5
7.5
0.85
1.1
66
0.24
© NXP B.V. 2011. All rights reserved.
378
Max
-
-
4
4.4
-
500
10
100
100
76
28
3100
256
23
105
116
63
-
-
-
1.2
-
-
-
Unit
V
V
V
V
V
µA
µA
nA
nA
mΩ
mΩ
pF
pF
pF
ns
ns
ns
ns
nH
nH
nH
V
V
ns
µC
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