MT47H64M8CF-25E IT:G Micron Technology Inc, MT47H64M8CF-25E IT:G Datasheet - Page 18
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MT47H64M8CF-25E IT:G
Manufacturer Part Number
MT47H64M8CF-25E IT:G
Description
64MX8 DDR2 SDRAM PLASTIC IND TEMP FBGA 1.8V
Manufacturer
Micron Technology Inc
- Current page: 18 of 129
- Download datasheet (3Mb)
Figure 8: 60-Ball FBGA (8mm x 10mm) – x4, x8
PDF: 09005aef8440dbbc
512mbddr2_ait_aat.pdf – Rev. C 7/11 EN
Solder ball material:
SAC305 (96.5% Sn,
3% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-reflow
on Ø0.35 SMD ball
pads.
60X Ø0.45
Seating
0.12 A
Plane
8 CTR
0.8 TYP
Notes:
A
Nonconductive overmold
9 8 7
1. All dimensions are in millimeters.
2. Solder ball material for this package is also available as leaded eutectic (62% Sn, 36%
Pb, 2% Ag).
1.8 CTR
6.4 CTR
8 ±0.1
Micron Confidential and Proprietary
0.8 TYP
3 2 1
A
B
C
D
E
F
G
H
J
K
L
18
512Mb: x8, x16 Automotive DDR2 SDRAM
0.8 ±0.05
10 ±0.1
Ball A1 ID
0.155
Micron Technology, Inc. reserves the right to change products or specifications without notice.
0.25 MIN
1.2 MAX
2010 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging
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