MT47H64M8CF-25E IT:G Micron Technology Inc, MT47H64M8CF-25E IT:G Datasheet - Page 21

• Manufacturer Part Number: MT47H64M8CF-25E IT:G
• Description: 64MX8 DDR2 SDRAM PLASTIC IND TEMP FBGA 1.8V
• Manufacturer: Micron Technology Inc

Table 6: Temperature Limits
Figure 9: Example Temperature Test Point Location
PDF: 09005aef8440dbbc
512mbddr2_ait_aat.pdf – Rev. C 7/11 EN
Parameter
Storage temperature
Operating temperature: commercial
Operating temperature: industrial
Operating temperature: automotive
Notes:
Test point
1. MAX storage case temperature T
2. MAX operating case temperature T
3. Device functionality is not guaranteed if the device exceeds maximum T
4. Both temperature specifications must be satisfied.
5. Operating ambient temperature surrounding the package.
in Figure 9. This case temperature limit is allowed to be exceeded briefly during package
reflow, as noted in Micron technical note TN-00-15, “Recommended Soldering Parame-
ters.”
in Figure 9.
operation.
Lmm x Wmm FBGA
Micron Confidential and Proprietary
Width (W)
0.5 (W)
Electrical Specifications – Absolute Ratings
Symbol
0.5 (L)
21
512Mb: x8, x16 Automotive DDR2 SDRAM
T
T
T
T
T
T
Length (L)
STG
A
A
C
C
C
STG
C
is measured in the center of the package, as shown
Micron Technology, Inc. reserves the right to change products or specifications without notice.
is measured in the center of the package, as shown
Min
–55
–40
–40
–40
–40
0
Max
150
105
105
85
95
85
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Units
°C
°C
°C
°C
°C
°C
C
during
Notes
2, 3 , 4
2, 3, 4
2, 3
4, 5
4, 5
1