MT48LC16M16A2P-6A:D Micron Technology Inc, MT48LC16M16A2P-6A:D Datasheet - Page 83

• Manufacturer Part Number: MT48LC16M16A2P-6A:D
• Description: DRAM Chip SDRAM 256M-Bit 16Mx16 3.3V 54-Pin TSOP-II Tray
• Manufacturer: Micron Technology Inc
• Type: SDRAMr

Specifications of MT48LC16M16A2P-6A:D

• Density: 256 Mb
• Maximum Clock Rate: 167 MHz
• Package: 54TSOP-II
• Address Bus Width: 15 Bit
• Operating Supply Voltage: 3.3 V
• Maximum Random Access Time: 5.4 ns
• Operating Temperature: 0 to 70 °C
• Format - Memory: RAM
• Memory Type: SDRAM
• Memory Size: 256M (16Mx16)
• Speed: 167MHz
• Interface: Parallel
• Voltage - Supply: 3 V ~ 3.6 V
• Package / Case: 54-TSOP II
• Organization: 16Mx16
• Address Bus: 15b
• Access Time (max): 5.4ns
• Operating Supply Voltage (typ): 3.3V
• Package Type: TSOP-II
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 135mA
• Pin Count: 54
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

SELF REFRESH Operation
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
The self refresh mode can be used to retain data in the device, even when the rest of the
system is powered down. When in self refresh mode, the device retains data without
external clocking. The SELF REFRESH command is initiated like an AUTO REFRESH
command, except CKE is disabled (LOW). After the SELF REFRESH command is regis-
tered, all the inputs to the device become “Don’t Care” with the exception of CKE,
which must remain LOW.
After self refresh mode is engaged, the device provides its own internal clocking, ena-
bling it to perform its own AUTO REFRESH cycles. The device must remain in self
refresh mode for a minimum period equal to
an indefinite period beyond that.
The procedure for exiting self refresh requires a sequence of commands. First, CLK
must be stable prior to CKE going back HIGH. (Stable clock is defined as a signal cycling
within timing constraints specified for the clock ball.) After CKE is HIGH, the device
must have NOP commands issued for a minimum of two clocks for
required for the completion of any internal refresh in progress.
Upon exiting the self refresh mode, AUTO REFRESH commands must be issued accord-
ing to the distributed refresh rate (
AUTO REFRESH utilize the row refresh counter.
83
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REF/refresh row count) as both SELF REFRESH and
Micron Technology, Inc. reserves the right to change products or specifications without notice.
t
RAS and remains in self refresh mode for
256Mb: x4, x8, x16 SDRAM
SELF REFRESH Operation
© 1999 Micron Technology, Inc. All rights reserved.
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XSR because time is