MT48LC32M16A2TG-75:C Micron Technology Inc, MT48LC32M16A2TG-75:C Datasheet - Page 52

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MT48LC32M16A2TG-75:C

Manufacturer Part Number
MT48LC32M16A2TG-75:C
Description
DRAM Chip SDRAM 512M-Bit 32Mx16 3.3V 54-Pin TSOP-II Tray
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48LC32M16A2TG-75:C

Density
512 Mb
Maximum Clock Rate
133 MHz
Package
54TSOP-II
Address Bus Width
15 Bit
Operating Supply Voltage
3.3 V
Maximum Random Access Time
6|5.4 ns
Operating Temperature
0 to 70 °C
Organization
32Mx16
Address Bus
15b
Access Time (max)
6/5.4ns
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
115mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT48LC32M16A2TG-75:C
Manufacturer:
MICRON/美光
Quantity:
20 000
Figure 36:
PDF: 09005aef809bf8f3/Source: 09005aef80818a4a
512MbSDRAM.fm - Rev. L 10/07 EN
DQML, DQMH
Auto-Refresh Mode
COMMAND
A11, A12
DQM /
BA0, BA1
A0–A9,
A10
CKE
CLK
DQ
Precharge all
High-Z
active banks
t CKS
t CMS
t AS
SINGLE BANK
ALL BANKS
PRECHARGE
BANK(S)
T0
t AH
t CKH
t CMH
t CK
t RP
T1
NOP
T2
REFRESH
AUTO
t CH
52
NOP
t RFC
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Micron Technology, Inc., reserves the right to change products or specifications without notice.
t CL
Tn + 1
REFRESH
AUTO
NOP
512Mb: x4, x8, x16 SDRAM
t
RFC
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©2000 Micron Technology, Inc. All rights reserved.
To + 1
ACTIVE
ROW
ROW
BANK
Timing Diagrams
Don’t Care

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