MT48LC32M16A2TG-75:C Micron Technology Inc, MT48LC32M16A2TG-75:C Datasheet - Page 53

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MT48LC32M16A2TG-75:C

Manufacturer Part Number
MT48LC32M16A2TG-75:C
Description
DRAM Chip SDRAM 512M-Bit 32Mx16 3.3V 54-Pin TSOP-II Tray
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48LC32M16A2TG-75:C

Density
512 Mb
Maximum Clock Rate
133 MHz
Package
54TSOP-II
Address Bus Width
15 Bit
Operating Supply Voltage
3.3 V
Maximum Random Access Time
6|5.4 ns
Operating Temperature
0 to 70 °C
Organization
32Mx16
Address Bus
15b
Access Time (max)
6/5.4ns
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
115mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT48LC32M16A2TG-75:C
Manufacturer:
MICRON/美光
Quantity:
20 000
Figure 37:
PDF: 09005aef809bf8f3/Source: 09005aef80818a4a
512MbSDRAM.fm - Rev. L 10/07 EN
DQML, DQMU
Self Refresh Mode
COMMAND
BA0, BA1
A11,A12
A0–A9,
DQM/
Notes:
CKE
A10
CLK
DQ
High-Z
Precharge all
t CKS
active banks
t CMS
t
SINGLE BANK
AS
ALL BANKS
PRECHARGE
BANK(S)
T0
1. No maximum time limit for self refresh;
2.
t CKH
t CMH
t
AH
t CK
t
XSR requires minimum of two clocks regardless of frequency or timing.
t RP
T1
NOP
t CH
Enter self refresh mode
t CKS
t CL
REFRESH
AUTO
T2
CLK stable prior to exiting
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53
self refresh mode
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
(Restart refresh time base)
t
RAS (MIN) applies to non-self refresh mode.
Tn + 1
Exit self refresh mode
NOP
t XSR
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or COMMAND
INHIBIT
To + 1
512Mb: x4, x8, x16 SDRAM
©2000 Micron Technology, Inc. All rights reserved.
To + 2
REFRESH
AUTO
Timing Diagrams
Don’t Care

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