XC6SLX150-3FGG484C Xilinx Inc, XC6SLX150-3FGG484C Datasheet - Page 27

• Manufacturer Part Number: XC6SLX150-3FGG484C
• Description: FPGA Spartan®-6 Family 147443 Cells 45nm (CMOS) Technology 1.2V 484-Pin FBGA
• Manufacturer: Xilinx Inc
• Series: Spartan® 6 LXr

Specifications of XC6SLX150-3FGG484C

• Package: 484FBGA
• Family Name: Spartan®-6
• Device Logic Cells: 147443
• Device Logic Units: 92152
• Number Of Registers: 184304
• Typical Operating Supply Voltage: 1.2 V
• Maximum Number Of User I/os: 338
• Ram Bits: 4939776
• Package / Case: 484-BGA
• Mounting Type: Surface Mount
• Voltage - Supply: 1 V ~ 3.6 V
• Operating Temperature: 0°C ~ 85°C
• Number Of I /o: 338
• Number Of Logic Elements/cells: 147443
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of Gates: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Output Delay Measurements
Output delays are measured using a Tektronix P6245
TDS500/600 probe (< 1 pF) across approximately 4" of FR4
microstrip trace. Standard termination was used for all
testing. The propagation delay of the 4" trace is
characterized separately and subtracted from the final
measurement, and is therefore not included in the
generalized test setups shown in
X-Ref Target - Figure 4
Table 31: Output Delay Measurement Methodology
DS162 (v2.0) March 31, 2011
Preliminary Product Specification
LVTTL (Low-Voltage Transistor-Transistor Logic)
LVCMOS (Low-Voltage CMOS), 3.3V
LVCMOS, 2.5V
LVCMOS, 1.8V
LVCMOS, 1.5V
LVCMOS, 1.2V
PCI (Peripheral Component Interface)
33 MHz and 66 MHz, 3.3V
HSTL (High-Speed Transceiver Logic), Class I
HSTL, Class II
HSTL, Class III
HSTL, Class I, 1.8V
HSTL, Class II, 1.8V
HSTL, Class III, 1.8V
SSTL (Stub Series Terminated Logic), Class I, 1.8V
SSTL, Class II, 1.8V
SSTL, Class I, 2.5V
FPGA Output
Figure 4: Single-Ended Test Setup
Description
V
REF
R
C
(probe capacitance)
REF
REF
Figure 4
V
(voltage level when taking
delay measurement)
MEAS
ds162_06_011309
and
Figure
5.
www.xilinx.com
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
LVCMOS33
HSTL_III_18
SSTL18_I
LVTTL (all)
LVCMOS25
LVCMOS18
LVCMOS15
LVCMOS12
PCI33_3, PCI66_3 (rising edge)
PCI33_3, PCI66_3 (falling edge)
HSTL_I
HSTL_II
HSTL_III
HSTL_I_18
HSTL_II_18
SSTL18_II
SSTL2_I
X-Ref Target - Figure 5
Measurements and test conditions are reflected in the IBIS
models except where the IBIS format precludes it.
Parameters V
the test conditions for each I/O standard. The most accurate
prediction of propagation delay in any given application can
be obtained through IBIS simulation, using the following
method:
1. Simulate the output driver of choice into the generalized
2. Record the time to V
3. Simulate the output driver of choice into the actual PCB
4. Record the time to V
5. Compare the results of steps 2 and 4. The increase or
I/O Standard
Attribute
test setup, using values from
trace and load, using the appropriate IBIS model or
capacitance value to represent the load.
decrease in delay yields the actual propagation delay of
the PCB trace.
FPGA Output
Figure 5: Differential Test Setup
REF
, R
REF
, C
C
MEAS
MEAS
R
REF
REF
()
1M
1M
1M
1M
1M
1M
25
25
50
25
50
50
25
50
50
25
50
REF
.
.
, and V
Table
C
(pF)
10
10
REF
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
(2)
(2)
MEAS
(1)
31.
R
fully describe
REF
V
V
V
V
V
V
V
V
ds162_07_011309
1.65
1.25
0.75
0.75
0.94
2.03
MEAS
(V)
1.1
1.4
0.9
0.9
REF
REF
REF
REF
REF
REF
REF
V
MEAS
+
–
V
0.75
0.75
1.25
(V)
3.3
1.5
0.9
0.9
1.8
0.9
0.9
REF
0
0
0
0
0
0
0
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