PBSS2515E,115 NXP Semiconductors, PBSS2515E,115 Datasheet
PBSS2515E,115
Specifications of PBSS2515E,115
934059166115
PBSS2515E T/R
PBSS2515E T/R
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PBSS2515E,115 Summary of contents
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PBSS2515E 15 V, 0.5 A NPN low V Rev. 02 — 21 April 2009 1. Product profile 1.1 General description NPN low V SOT416 (SC-75) Surface-Mounted Device (SMD) plastic package. PNP complement: PBSS3515E. 1.2 Features I Low collector-emitter saturation voltage ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number PBSS2515E 4. Marking Table 4. Type number PBSS2515E 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO tot amb T stg [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. ...
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... NXP Semiconductors (1) FR4 PCB, mounting pad for collector 1 cm (2) FR4 PCB, standard footprint Fig 1. 6. Thermal characteristics Table 6. Symbol R th(j-a) R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm ...
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... NXP Semiconductors 3 10 duty cycle = 1 Z 0.75 th(j-a) (K/W) 0.5 0.33 0 0.1 0.05 0. FR4 PCB, standard footprint Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 3 10 duty cycle = 1 Z th(j-a) 0.75 (K/W) 0.5 0.33 ...
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... NXP Semiconductors 7. Characteristics Table unless otherwise specified. amb Symbol I CBO I EBO CEsat R CEsat V BEsat V BEon off [1] Pulse test: t PBSS2515E_2 Product data sheet Characteristics Parameter Conditions collector-base cut-off current 150 C j emitter-base cut-off current DC current gain collector-emitter mA saturation voltage I = 200 mA 500 mA; I ...
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... NXP Semiconductors 800 h FE (1) 600 (2) 400 (3) 200 ( 100 C amb ( amb ( amb Fig 4. DC current gain as a function of collector current; typical values 1100 V BE (mV) 900 (1) 700 (2) 500 (3) 300 100 ( amb ( amb ( 100 C amb Fig 6. Base-emitter voltage as a function of collector current; typical values ...
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... NXP Semiconductors 1 V CEsat ( ( ( 100 C amb ( amb ( amb Fig 8. Collector-emitter saturation voltage as a function of collector current; typical values CEsat ( ) ( 100 C amb ( amb ( amb Fig 10. Collector-emitter saturation resistance as a function of collector current; typical values PBSS2515E_2 Product data sheet 15 V, 0.5 A NPN low V ...
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... NXP Semiconductors 8. Test information Fig 12. BISS transistor switching time definition Fig 13. Test circuit for switching times PBSS2515E_2 Product data sheet (probe) oscilloscope 450 250 mA 12.5 mA Bon Rev. 02 — 21 April 2009 PBSS2515E 15 V, 0.5 A NPN low V CEsat input pulse (idealized waveform) I (100 %) ...
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... NXP Semiconductors 9. Package outline Fig 14. Package outline SOT416 (SC-75) 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package PBSS2515E [1] For further information and the availability of packing methods, see 11. Soldering Fig 15. Reflow soldering footprint SOT416 (SC-75) ...
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... Document ID Release date PBSS2515E_2 20090421 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Figure • Table 6 “Thermal • ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 10 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 Revision history ...