PBSS5140T,215 NXP Semiconductors, PBSS5140T,215 Datasheet
PBSS5140T,215
Specifications of PBSS5140T,215
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PBSS5140T T/R
PBSS5140T T/R
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PBSS5140T,215 Summary of contents
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PBSS5140T PNP low V Rev. 04 — 29 July 2008 1. Product profile 1.1 General description PNP low V small Surface-Mounted Device (SMD) plastic package. NPN complement: PBSS4140T. 1.2 Features I Low collector-emitter saturation voltage V ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number PBSS5140T 4. Marking Table 4. Type number PBSS5140T [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol ...
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... NXP Semiconductors Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol P tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm ...
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... NXP Semiconductors 3 10 duty cycle = Z 1 th(j-a) (K/W) 0.75 0.5 0. 0.2 0.1 0.05 0. FR4 PCB, standard footprint Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 3 10 duty cycle = Z th(j-a) 1 (K/W) 0.75 0 0.33 0.2 0.1 ...
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... NXP Semiconductors 7. Characteristics Table unless otherwise specified. amb Symbol I CBO I CEO I EBO CEsat R CEsat V BEsat V BEon off [1] Pulse test: t PBSS5140T_4 Product data sheet Characteristics Parameter Conditions collector-base cut-off current 150 C j collector-emitter cut-off current emitter-base cut-off current DC current gain collector-emitter I = 100 mA ...
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... NXP Semiconductors 1000 h FE 800 (1) 600 (2) 400 (3) 200 ( 100 C amb ( amb ( amb Fig 4. DC current gain as a function of collector current; typical values 1 (V) (1) 0.8 (2) ( amb ( amb ( 100 C amb Fig 6. Base-emitter voltage as a function of collector current; typical values PBSS5140T_4 Product data sheet ...
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... NXP Semiconductors 1 V CEsat ( (1) ( 100 C amb ( amb ( amb Fig 8. Collector-emitter saturation voltage as a function of collector current; typical values CEsat ( ) ( 100 C amb ( amb ( amb Fig 10. Collector-emitter saturation resistance as a function of collector current; typical values PBSS5140T_4 Product data sheet 006aab315 V CEsat (mA) C Fig 9 ...
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... NXP Semiconductors 8. Test information Fig 12. BISS transistor switching time definition Fig 13. Test circuit for switching times PBSS5140T_4 Product data sheet (probe) oscilloscope 450 0 mA Bon Rev. 04 — 29 July 2008 PBSS5140T PNP low V CEsat input pulse (idealized waveform) I (100 %) Bon I Boff output pulse ...
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... NXP Semiconductors 9. Package outline Fig 14. Package outline SOT23 (TO-236AB) 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package PBSS5140T [1] For further information and the availability of packing methods, see PBSS5140T_4 Product data sheet 3 ...
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... NXP Semiconductors 11. Soldering 3 1.7 Fig 15. Reflow soldering footprint SOT23 (TO-236AB) 4.6 2.6 Fig 16. Wave soldering footprint SOT23 (TO-236AB) PBSS5140T_4 Product data sheet 3.3 2.9 1 2 1.4 2.8 4.5 Rev. 04 — 29 July 2008 PBSS5140T PNP low V BISS transistor ...
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... Release date PBSS5140T_4 20080729 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Table 4 “Marking • Table 5 “Limiting • ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 10 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 12 Revision history ...