PDTD113ZT,215 NXP Semiconductors, PDTD113ZT,215 Datasheet
PDTD113ZT,215
Specifications of PDTD113ZT,215
PDTD113ZT T/R
PDTD113ZT T/R
Related parts for PDTD113ZT,215
PDTD113ZT,215 Summary of contents
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PDTD113ZT NPN 500 mA resistor-equipped transistor Rev. 02 — 23 March 2009 1. Product profile 1.1 General description NPN 500 mA Resistor-Equipped Transistor (RET small Surface-Mounted Device ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number Package PDTD113ZT 4. Marking Table 4. Type number PDTD113ZT [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). ...
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... NXP Semiconductors Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol P tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics Table 6. Symbol R th(j-a) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. ...
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... NXP Semiconductors ( 100 C amb ( amb ( amb Fig 1. DC current gain as a function of collector current; typical values 10 V I(on) (V) 1 (1) ( amb ( amb ( 100 C amb Fig 3. On-state input voltage as a function of collector current; typical values PDTD113ZT_2 Product data sheet NPN 500 mA resistor-equipped transistor ...
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... NXP Semiconductors 8. Package outline Fig 5. 9. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package PDTD113ZT [1] For further information and the availability of packing methods, see PDTD113ZT_2 Product data sheet NPN 500 mA resistor-equipped transistor ...
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... NXP Semiconductors 10. Soldering 3 1.7 Fig 6. 4.6 2.6 Fig 7. PDTD113ZT_2 Product data sheet NPN 500 mA resistor-equipped transistor 3.3 2.9 1 Reflow soldering footprint SOT23 (TO-236AB) 2 1.4 2.8 4.5 Wave soldering footprint SOT23 (TO-236AB) Rev. 02 — 23 March 2009 PDTD113ZT ...
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... PDTD113ZT_2 20090323 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Type numbers PDTD113ZK and PDTD113ZS removed • ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 14. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Legal information ...