PCF2123TS/1.118 NXP Semiconductors, PCF2123TS/1.118 Datasheet - Page 47
PCF2123TS/1.118
Manufacturer Part Number
PCF2123TS/1.118
Description
Manufacturer
NXP Semiconductors
Datasheet
1.PCF2123TS1.118.pdf
(61 pages)
Specifications of PCF2123TS/1.118
Bus Type
Serial (3-Wire, SPI)
Package Type
TSSOP
Operating Supply Voltage (max)
5.5V
Operating Temperature Classification
Industrial
Operating Temperature (max)
85C
Operating Temperature (min)
-40C
Mounting
Surface Mount
Date Format
DW:DM:M:Y
Time Format
HH:MM:SS
Lead Free Status / RoHS Status
Compliant
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NXP Semiconductors
Fig 31. Package outline SOT758-1 (HVQFN16) of PCF2123BS/1
PCF2123
Product data sheet
HVQFN16: plastic thermal enhanced very thin quad flat package; no leads;
16 terminals; body 3 x 3 x 0.85 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT758-1
max.
A
1
(1)
terminal 1
index area
terminal 1
index area
0.05
0.00
A 1
E h
L
0.30
0.18
b
4
1
IEC
- - -
0.2
c
16
5
D
3.1
2.9
(1)
e
0
1.75
1.45
D h
D h
e 1
D
All information provided in this document is subject to legal disclaimers.
MO-220
JEDEC
1/2
E
3.1
2.9
e
(1)
REFERENCES
b
Rev. 03 — 5 October 2010
13
8
1.75
1.45
E h
12
w
9
v
0.5
e
B
M
M
JEITA
scale
e
- - -
2.5
C
C
A
E
1/2
1.5
e 1
A
e
B
e 2
1.5
e 2
0.5
0.3
L
0.1
v
A
y 1 C
A 1
5 mm
0.05
w
PROJECTION
EUROPEAN
SPI Real time clock/calendar
0.05
y
detail X
0.1
y 1
X
C
PCF2123
© NXP B.V. 2010. All rights reserved.
y
ISSUE DATE
02-03-25
02-10-21
SOT758-1
c
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