UJA1065TW/3V3-T NXP Semiconductors, UJA1065TW/3V3-T Datasheet - Page 68
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
UJA1065TW/3V3-T
Manufacturer Part Number
UJA1065TW/3V3-T
Description
Network Controller & Processor ICs HI SPEED CAN SYSTEM
Manufacturer
NXP Semiconductors
Datasheet
1.UJA1065TW3V3-T.pdf
(76 pages)
Specifications of UJA1065TW/3V3-T
Number Of Transceivers
1
Power Down Mode
Standby
Operating Supply Voltage (min)
5.5V
Supply Current
10mA
Operating Temperature (max)
125C
Operating Temperature (min)
-40C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Product
Controller Area Network (CAN)
Data Rate
20 Kbps
Supply Voltage (max)
27 V, 52 V
Supply Voltage (min)
5.5 V
Supply Current (max)
10 mA
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Package / Case
HTSSOP EP
Lead Free Status / RoHS Status
Compliant
Other names
UJA1065TW/3V3,518
NXP Semiconductors
12. Package outline
Fig 29. Package outline SOT549-1 (HTSSOP32)
UJA1065_7
Product data sheet
HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
E h
VERSION
OUTLINE
SOT549-1
max.
32
1.1
1
A
Z
y
pin 1 index
0.15
0.05
A 1
0.95
0.85
A 2
IEC
0.25
A 3
exposed die pad side
e
0.30
0.19
b p
D h
D
0.20
0.09
c
MO-153
JEDEC
11.1
10.9
D
(1)
REFERENCES
Rev. 07 — 25 February 2010
0
D h
5.1
4.9
E
6.2
6.0
b
(2)
p
JEITA
scale
17
16
2.5
E h
3.6
3.4
w
c
High-speed CAN/LIN fail-safe system basis chip
M
0.65
e
A 2
5 mm
A 1
H E
8.3
7.9
L
1
0.75
0.50
L p
H E
E
PROJECTION
detail X
EUROPEAN
0.2
v
L
L
p
0.1
w
UJA1065
© NXP B.V. 2010. All rights reserved.
(A 3 )
0.1
y
A
ISSUE DATE
03-04-07
05-11-02
0.78
0.48
θ
X
Z
SOT549-1
A
v
M
8
0
θ
o
o
68 of 76
A