PIC16F1518-E/SP Microchip Technology, PIC16F1518-E/SP Datasheet - Page 294

• Manufacturer Part Number: PIC16F1518-E/SP
• Description: 28-pin, 28KB Flash, 1024B RAM, 10-bit ADC, 2xCCP, SPI, MI2C, EUSART, 2.3V-5.5V 2
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 16Fr

Specifications of PIC16F1518-E/SP

• Processor Series: PIC16F151x
• Core: PIC
• Data Bus Width: 8 bit
• Program Memory Type: Flash
• Program Memory Size: 16 KB
• Data Ram Size: 1 KB
• Interface Type: I2C, SPI, USART
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 3
• Operating Supply Voltage: 2.3 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• Package / Case: PDIP-28
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 25
• Eeprom Size: -
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.3 V ~ 5.5 V
• Data Converters: A/D 17x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Lead Free Status / Rohs Status: Details

PIC16(L)F1516/7/8/9
25.6
DS41452B-page 294
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  T
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Legend:
Note 1: I
Param
No.
2: T
3: T
Thermal Considerations
P
DD
INTERNAL
A
J
T
Sym.
P
TBD = To Be Determined
P
= Junction Temperature.


JMAX
= Ambient Temperature.
PD
DER
is current to run the chip alone without driving any load on the output pins.
JA
JC
I
/
O
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
Maximum Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
A
Characteristic
 +125°C
Preliminary
Typ.
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
150
—
—
—
—
Units
 C/W
 C/W
 C/W
 C/W
 C/W
 C/W
 C/W
 C/W
 C/W
 C/W
 C/W
 C/W
 C/W
 C/W
 C
W
W
W
W
PD = P
P
P
28-pin SOIC package
28-pin SPDIP package
28-pin SSOP package
28-pin UQFN package
40-pin PDIP package
40-pin UQFN package
44-pin TQFP package
28-pin SOIC package
28-pin SPDIP package
28-pin SSOP package
28-pin UQFN package
40-pin PDIP package
40-pin UQFN package
44-pin TQFP package
P
INTERNAL
I
DER
/
O
=  (I
= PD
INTERNAL
 2011 Microchip Technology Inc.
OL
= I
MAX
* V
DD
Conditions
(T
OL
+ P
x V
J
) +  (I
- T
DD (1)
I
/
O
A
)/ 
OH
JA (2)
* (V
DD
- V
OH
))