PIC32MX360F512LT-80I/BG Microchip Technology, PIC32MX360F512LT-80I/BG Datasheet - Page 31

512 KB Flash, 32 KB RAM, 80 MHz, 10-Bit ADC, DMA Trace 121 XBGA 10x10x1.20mm T/R

PIC32MX360F512LT-80I/BG

Manufacturer Part Number
PIC32MX360F512LT-80I/BG
Description
512 KB Flash, 32 KB RAM, 80 MHz, 10-Bit ADC, DMA Trace 121 XBGA 10x10x1.20mm T/R
Manufacturer
Microchip Technology
Series
PIC® 32MXr

Specifications of PIC32MX360F512LT-80I/BG

Core Processor
MIPS32® M4K™
Core Size
32-Bit
Speed
80MHz
Connectivity
I²C, IrDA, LIN, PMP, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.3 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
121-TFBGA
Processor Series
PIC32MX3xx
Core
MIPS
3rd Party Development Tools
52713-733, 52714-737
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, DM320001, DM320002, MA320001
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of I /o
-
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

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Part Number
Manufacturer
Quantity
Price
Part Number:
PIC32MX360F512LT-80I/BG
Manufacturer:
Microchip Technology
Quantity:
10 000
2.0
2.1
Getting started with the PIC32MX3XX/4XX family of
32-bit Microcontrollers (MCUs) requires attention to a
minimal set of device pin connections before
proceeding with development. The following is a list of
pin names, which must always be connected:
• All V
• All AV
• V
• MCLR pin
• PGECx/PGEDx pins used for In-Circuit Serial
• OSC1 and OSC2 pins when external oscillator
Additionally, the following pins may be required:
• V
© 2010 Microchip Technology Inc.
(see Section 2.2 “Decoupling Capacitors”)
is not used)
(see Section 2.2 “Decoupling Capacitors”)
(see Section 2.3 “Capacitor on Internal Voltage
Regulator (V
(see Section 2.4 “Master Clear (MCLR) Pin”)
Programming™ (ICSP™) and debugging purposes
(see Section 2.5 “ICSP Pins”)
source is used
(see Section 2.8 “External Oscillator Pins”)
reference for ADC module is implemented
Note:
Note 1: This data sheet summarizes the features
REF
CAP
DD
+/V
/V
DD
2: Some registers and associated bits
GUIDELINES FOR GETTING
STARTED WITH 32-BIT
MICROCONTROLLERS
Basic Connection Requirements
DDCORE
and V
REF
and AV
The AV
connected independent of ADC use and
ADC voltage reference source.
of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to the “PIC32MX Family
Reference Manual”, which is available
from
(www.microchip.com/PIC32).
described in this section may not be avail-
able on all devices. Refer to Section 4.0
“Memory Organization” in this data
sheet for device-specific register and bit
information.
- pins used when external voltage
CAP
SS
the
SS
pins
/V
DD
the
DDCORE
pins (regardless if ADC module
PIC32MX3XX/4XX
and AV
Microchip
)”)
SS
pins must be
web
family
site
of
2.2
The use of decoupling capacitors on every pair of
power supply pins, such as V
AV
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: Recommendation
• Placement on the printed circuit board: The
• Handling high frequency noise: If the board is
• Maximizing performance: On the board layout
of 0.1 µF (100 nF), 10-20V. This capacitor should
be a low-ESR and have resonance frequency in
the range of 20 MHz and higher. It is
recommended that ceramic capacitors be used.
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within
one-quarter inch (6 mm) in length.
experiencing high frequency noise, upward of
tens of MHz, add a second ceramic-type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum thereby reducing PCB track inductance.
SS
is required. See Figure 2-1.
PIC32MX3XX/4XX
Decoupling Capacitors
DD
, V
DS61143G-page 31
SS
, AV
DD
and

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