TZA3033T/C3,112 NXP Semiconductors, TZA3033T/C3,112 Datasheet - Page 20
TZA3033T/C3,112
Manufacturer Part Number
TZA3033T/C3,112
Description
Manufacturer
NXP Semiconductors
Datasheet
1.TZA3033TC3112.pdf
(28 pages)
Specifications of TZA3033T/C3,112
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
8
Lead Free Status / RoHS Status
Compliant
Philips Semiconductors
PACKAGE OUTLINE
2002 Sep 06
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SDH/SONET STM1/OC3
transimpedance amplifier
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
inches
UNIT
mm
VERSION
OUTLINE
SOT96-1
0.069
max.
1.75
A
0.010
0.004
0.25
0.10
A
1
0.057
0.049
1.45
1.25
A
076E03
2
IEC
1
8
Z
pin 1 index
0.25
0.01
A
y
3
e
0.019
0.014
0.49
0.36
b
p
D
0.0100
0.0075
0.25
0.19
MS-012
JEDEC
c
b
REFERENCES
p
0.20
0.19
D
5.0
4.8
5
4
0
(1)
w
0.16
0.15
E
4.0
3.8
(2)
M
scale
0.050
EIAJ
1.27
20
2.5
c
e
A
0.244
0.228
2
H
6.2
5.8
A
E
1
0.041
1.05
5 mm
L
H
0.039
0.016
E
E
1.0
0.4
detail X
L
p
0.028
0.024
L
L
0.7
0.6
Q
p
Q
PROJECTION
(A )
EUROPEAN
0.25
0.01
3
A
v
0.25
0.01
A
w
X
v
M
Product specification
0.004
A
0.1
y
TZA3033
ISSUE DATE
97-05-22
99-12-27
0.028
0.012
Z
0.7
0.3
(1)
SOT96-1
8
0
o
o