TDA8351N6 NXP Semiconductors, TDA8351N6 Datasheet - Page 11

• Manufacturer Part Number: TDA8351N6
• Manufacturer: NXP Semiconductors

Specifications of TDA8351N6

• Lead Free Status / RoHS Status: Compliant

Philips Semiconductors
PACKAGE OUTLINE
1999 Sep 27
SIL9P: plastic single in-line power package; 9 leads
DC-coupled vertical deflection circuit
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT131-2
max.
2.0
A
1
1
Z
4.6
4.2
A
2
max.
1.1
b
IEC
e
0.75
0.60
b
p
D
d
0.48
0.38
c
b
JEDEC
p
24.0
23.6
D
(1)
REFERENCES
w
20.0
19.6
M
d
0
9
b
D
j
10
h
scale
EIAJ
11
5
12.2
11.8
E
(1)
non-concave
E h
10 mm
2.54
e
L
x
A
B
E
6
1
h
view B: mounting base side
Q
3.4
3.1
A 2
j
c
17.2
16.5
PROJECTION
EUROPEAN
L
D
E
h
2.1
1.8
Q
Product specification
0.25
w
TDA8351
ISSUE DATE
92-11-17
95-03-11
0.03
x
SOT131-2
2.00
1.45
Z
(1)