TZA3023T NXP Semiconductors, TZA3023T Datasheet - Page 21

• Manufacturer Part Number: TZA3023T
• Manufacturer: NXP Semiconductors

Specifications of TZA3023T

• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 8
• Lead Free Status / RoHS Status: Not Compliant

Philips Semiconductors
PACKAGE OUTLINE
2002 Sep 05
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SDH/SONET STM4/OC12
transimpedance amplifier
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
inches
UNIT
mm
VERSION
OUTLINE
SOT96-1
0.069
max.
1.75
A
0.010
0.004
0.25
0.10
A
1
0.057
0.049
1.45
1.25
A
076E03
2
IEC
1
8
Z
pin 1 index
0.25
0.01
A
y
3
e
0.019
0.014
0.49
0.36
b
p
D
0.0100
0.0075
0.25
0.19
MS-012
JEDEC
c
b
REFERENCES
p
0.20
0.19
D
5.0
4.8
5
4
0
(1)
w
0.16
0.15
E
4.0
3.8
(2)
M
scale
0.050
EIAJ
1.27
21
2.5
c
e
A
0.244
0.228
2
H
6.2
5.8
A
E
1
0.041
1.05
5 mm
L
H
0.039
0.016
E
E
1.0
0.4
detail X
L
p
0.028
0.024
L
L
0.7
0.6
Q
p
Q
PROJECTION
(A )
EUROPEAN
0.25
0.01
3
A
v
0.25
0.01
A
w
X
v
M
Product specification
0.004
A
0.1
y
TZA3023
ISSUE DATE
97-05-22
99-12-27
0.028
0.012
Z
0.7
0.3
(1)
SOT96-1
8
0
o
o