TZA3023T NXP Semiconductors, TZA3023T Datasheet - Page 4
TZA3023T
Manufacturer Part Number
TZA3023T
Description
Manufacturer
NXP Semiconductors
Datasheet
1.TZA3023T.pdf
(28 pages)
Specifications of TZA3023T
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
8
Lead Free Status / RoHS Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TZA3023T
Manufacturer:
TAIYO
Quantity:
60 000
Part Number:
TZA3023T
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Philips Semiconductors
PINNING
Note
1. For the TZA3023U/G this pad is connected to the gold layer on top of the passivation layer.
2002 Sep 05
DREF
GND
IPhoto
GND
GND
OUT
OUTQ
V
AGC
SYMBOL
CC
SDH/SONET STM4/OC12
transimpedance amplifier
TZA3023T
PIN
1
2
3
4
5
6
7
8
TZA3023U
11, 12
PAD
2, 3
5, 6
7, 8
10
13
handbook, halfpage
1
4
9
analog output
ground
analog input
ground
ground
output
output
supply
input/output
TYPE
IPhoto
DREF
GND
GND
Fig.2 Pin configuration.
1
2
3
4
TZA3023T
bias voltage for PIN diode; cathode should be connected to
this pin; note 1
ground
current input; anode of PIN diode should be connected to this
pin; DC bias level of 800 mV, one diode voltage above ground
ground
ground
data output; pin OUT goes HIGH when current flows into
pin IPhoto
data output; compliment of pin OUT
supply voltage
AGC analog I/O
4
MGK917
7
6
5
8
V CC
OUT
GND
OUTQ
DESCRIPTION
Product specification
TZA3023