MMA7455LR2 Freescale, MMA7455LR2 Datasheet - Page 31

• Manufacturer Part Number: MMA7455LR2
• Manufacturer: Freescale

Specifications of MMA7455LR2

• Family Name: MMA7455L
• Package Type: LGA
• Operating Supply Voltage (min): 2.4V
• Operating Supply Voltage (typ): 2.8V
• Operating Supply Voltage (max): 3.6V
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Product Depth (mm): 3mm
• Product Height (mm): 1mm
• Product Length (mm): 5mm
• Mounting: Surface Mount
• Pin Count: 14
• Lead Free Status / RoHS Status: Compliant

6.
7.
8.
9.
10. Do not use a screw down or stacking to fix the PCB into an enclosure because this could bend the PCB putting stress on
11. The PCB should be rated for the multiple lead-free reflow condition with max 260°C temperature.
Please cross reference with the device data sheet for mounting guidelines specific to the exact device used.
Freescale LGA sensors are compliant with Restrictions on Hazardous Substances (RoHS), having halide free molding compound
(green) and lead-free terminations. These terminations are compatible with tin-lead (Sn-Pb) as well as tin-silver-copper
(Sn-Ag-Cu) solder paste soldering processes. Reflow profiles applicable to those processes can be used successfully for solder-
ing the devices.
Sensors
Freescale Semiconductor
Do not place any components or vias at a distance less than 2 mm from the package land area. This may cause additional
package stress if it is too close to the package land area.
Signal traces connected to pads should be as symmetric as possible. Put dummy traces on NC pads in order to have same
length of exposed trace for all pads. Signal traces with 0.1 mm width and min. 0.5 mm length for all PCB land pads near the
package are recommended as shown in
Use a standard pick and place process and equipment. Do not us a hand soldering process.
It is recommended to use a cleanable solder paste with an additional cleaning step after SMT mount.
the package.
10x0.8mm
Figure 22. Stencil Design Guidelines
Figure 21
and
14x0.575mm
Figure
22. Wider trace can be continued after the 0.5 mm zone.
Signal trace near
package
14x0.875mm
Package
footprint
Stencil opening = PCB landing
pad -0.025mm
= 0.575mmx0,875mm
MMA7455L
31