MT49H32M9FM-33 IT Micron Technology Inc, MT49H32M9FM-33 IT Datasheet - Page 42

• Manufacturer Part Number: MT49H32M9FM-33 IT
• Manufacturer: Micron Technology Inc
• Type: RLDRAMr

Specifications of MT49H32M9FM-33 IT

• Organization: 32Mx9
• Density: 288Mb
• Address Bus: 22b
• Maximum Clock Rate: 300MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: uBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 609mA
• Pin Count: 144
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Not Compliant

Operations
INITIALIZATION
PDF: 09005aef80a41b46/Source: 09005aef809f284b
RLDRAM_II_CIO_Core.fm - Rev. D 12/10 EN
Notes:
1. It is possible to apply V
2. If V
1. Apply power (V
2. Maintain stable conditions for 200µs (MIN).
3. Issue at least three consecutive MRS commands: two or more dummies plus one valid
4.
The RLDRAM must be powered up and initialized in a predefined manner. Operational
procedures other than those specified may result in undefined operations or permanent
damage to the device.
The following sequence is used for power-up:
ages are stable. Apply V
before or at the same time as
between V
ages approach their nominal levels. CK/CK# must meet V
applied.
while applying NOP conditions to the command pins guarantees that the RLDRAM
will not receive unwanted commands during initialization.
MRS. The purpose of these consecutive MRS commands is to internally reset the logic
of the RLDRAM. Note that
commands. It is recommended that all address pins are held LOW during the dummy
MRS commands.
t
1,024 NOP commands) must be issued prior to normal operation. The sequence of
the eight AUTO REFRESH commands (with respect to the 1,024 NOP commands)
does not matter. As is required for any operation,
REFRESH command and a subsequent VALID command to the same bank. Note that
older versions of the data sheet required each of these AUTO REFRESH commands be
separated by 2,048 NOP commands. This properly initializes the RLDRAM but is no
longer required.
all other pins with an output driver, will go HIGH instead of tri-stating. These pins will
remain HIGH until V
bus conflicts during this period.
large external resistor from CS# to V
bus does not receive unwanted commands during this unspecified state.
MRSC after the valid MRS, an AUTO REFRESH command to all 8 banks (along with
ID
288Mb: x9, x18, x36 2.5V V
(DC)
2
on CK/CK# can not be met prior to being applied to the RLDRAM, placing a
Apply NOP conditions to command pins. Ensuring CK/CK# meet V
EXT
and V
EXT
, V
DD
DD
DD
DDQ
, the chip starts the power-up sequence only after both volt-
DD
is at the same level as V
, V
t
and V
42
DDQ
MRSC does not need to be met between these consecutive
before V
,
V
EXT
V
REF
REF
DD
DD
, V
Micron Technology, Inc., reserves the right to change products or specifications without notice.
before or at the same time as V
and V
. However, when doing this, the DQs, DM, and
TT
is a viable option for ensuring the command
EXT
) and start clock as soon as the supply volt-
, 1.8V V
TT
. Although there is no timing relation
DDQ
t
RC must be met between an AUTO
. Care should be taken to avoid
DD
, HSTL, CIO, RLDRAM II
©2004 Micron Technology, Inc. All rights reserved.
ID(DC)
DDQ
prior to being
Operations
.
1
Apply V
ID(DC)
DDQ