NH82801IO S LAFD Intel, NH82801IO S LAFD Datasheet - Page 22

• Manufacturer Part Number: NH82801IO S LAFD
• Manufacturer: Intel

Specifications of NH82801IO S LAFD

• Lead Free Status / RoHS Status: Compliant

12.
22
GPIO[5:2]
Name
Update the following ball designation for ICH9M-SFF package ball AC22 in Figure 6-6
and Table 6-3
Figure 6-6 Intel-SFF Ballout(Top view-Right Side)
Table 6-3 ICH9M-SFF Ballout by Signal Name - (Mobile Only)
Remove Preliminary from the title of Figure 6-5 and Figure 6-6:
Figure 6-5. Intel® ICH9M SFF Ballout(Top View-Left Side)
Figure 6-6. Intel® ICH9M SFF Ballout(Top View-Right Side)
Correct Typo for Table 2-22 General Purpose I/O Signals for
GPIO[5:2]
Indicate the proper Note for GPIO[5:2] in Table 2-2 General Purpose I/O Signals for
GPIO[5:2] in the Datasheet.
NOTES:
1.
2.
3.
CPUPWR
Names
TP12
TP12
VSS
GD
22
All GPIOs can be configured as either input or output.
Some GPIOs exist in the VccSus3_3 power plane. Care must be taken to make sure GPIO
GPI[15:0] can be configured to cause a SMI# or SCI. Note that a GPI can be routed to
either an SMI# or an SCI, but not both.
signals are not driven high into powered-down planes. Also, external devices should not be
driving powered down GPIOs high. Some ICH9 GPIOs may be connected to pins on devices
that exist in the core well. If these GPIOs are outputs, there is a danger that a loss of core
Type
I/OD
THRMTR
IGNNE#
DPRSTP
Tolerance
IP#
23
#
5 V
Ball
AC22
DPSLP#
INTR
VSS
Power
24
Well
Core
STPCLK
FERR# AD
Default
VSS
25
#
GPI
AC
AE
Description
Multiplexed with PIRQ[H:E]# (Note 7 ).
Documentation Changes
Specification Update