FDC37C935-QS Standard Microsystems (SMSC), FDC37C935-QS Datasheet - Page 200

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FDC37C935-QS

Manufacturer Part Number
FDC37C935-QS
Description
Manufacturer
Standard Microsystems (SMSC)
Datasheet

Specifications of FDC37C935-QS

Lead Free Status / RoHS Status
Supplier Unconfirmed
5
DETAIL "A"
L1
0
E3
E1
H
L
L1
R1
R2
T D
T E
A2
D
D1
e
W
A
A1
L
R1
MIN
30.95
27.90
0.10
0.65
3.10
30.95
27.90
0.20
0.05
0
R2
0
1
E
0.65BSC
-C-
NOM
31.20
28.00
0.80
1.60
31.20
28.00
30.45
0.20
0.30
30.45
E1
H
0.10
FIGURE 23 - 160 PIN QFP PACKAGE OUTLINE
121
160
A
MAX
31.45
28.10
0.200
0.95
A1
3.67
31.45
28.10
0.40
4.07
0.5
7
1
120
D1/4
A2
E1/4
Notes:
1)
2)
3)
4)
5)
6)
7)
7
D1
SEE DETAIL
include the mold protrusion. Maximum mold
protrusion is 0.25 mm
Dimension for foot length L when measured at
D
mm maximum
by robotic handler
the gauge plane 0.25 mm above the seating
plane, is 0.78 - 1.03 mm
be located within the zone indicated
Coplanarity is 0.100 mm
Tolerance on the position of the leads is 0.120
Package body dimensions D1 and E1 do
Dimensions T
Dimensions for foot length L when measured
the centerline of the leads are given at the table
Controlling dimension: millimeter
Details of pin 1 identifier are optional but must
T
200
D
/ T
E
3
D
and T
81
40
E
are important for testing
4
80
41
2
0
e
W

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