SPEAR09H042 STMicroelectronics, SPEAR09H042 Datasheet
SPEAR09H042
Specifications of SPEAR09H042
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SPEAR09H042 Summary of contents
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... I C master mode, fast and slow speed ■ 6 general purpose I/Os Table 1. Device summary Order code SPEAR-09-H042 January 2008 For further information contact your local STMicroelectronics sales office. SPEAR-09-H042 ■ Real time clock ■ WatchDog ■ 4 general purpose timers ■ Operating temperature °C ■ ...
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Contents Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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SPEAR-09-H042 1 Introduction This data brief describes the differences between SPEAr Head200 (SPEAR-09-H022) and the one packaged in LFBGA289 balls 0.8mm pitch (SPEAR-09-H042). In this document the main package characteristics are described as well as the chip features modifications. The ...
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Features modification 2 Features modification To fit the new small package a number of features has been reduced or limited: ● Analog to digital converter (ADC) ● eASIC GPIOs ● External FPGA emulation mode ● Dynamic RAM data path ● ...
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SPEAR-09-H042 3 Pin description Table 2 shows the component signals, grouped by function, and the relative ballout diagram. 3.1 Interface signals Table 2. Interface signals Group Debug eASIC eASICGP_IO[00] eASICGP_IO[01] eASICGP_IO[02] eASICGP_IO[03] eASICGP_IO[04] eASICGP_IO[05] eASICGP_IO[06] eASICGP_IO[07] eASICGP_IO[08] eASICGP_IO[09] eASICGP_IO[10] eASICGP_IO[11] ...
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Pin description Table 2. Interface signals (continued) Group eASICGP_IO[22] eASICGP_IO[23] eASICGP_IO[24] eASICGP_IO[25] eASICGP_IO[26] eASICGP_IO[27] eASICGP_IO[28] eASICGP_IO[29] eASICGP_IO[30] eASICGP_IO[31] eASICGP_IO[32] eASICGP_IO[33] eASICGP_IO[34] eASICGP_IO[35] eASICGP_IO[36] eASICGP_IO[37] eASICGP_IO[38] eASICGP_IO[39] eASICGP_IO[40] eASICGP_IO[41] eASICGP_IO[42] eASICGP_IO[43] eASICGP_IO[44] eASICGP_IO[45] eASICGP_IO[46] eASICGP_IO[47] eASICGP_IO[48] eASICGP_IO[49] eASICGP_IO[50] eASICGP_IO[51] eASICGP_IO[52] eASICGP_IO[53] ...
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SPEAR-09-H042 Table 2. Interface signals (continued) Group eASICGP_IO[57] eASICGP_IO[58] eASICGP_IO[59] eASICGP_IO[60] eASICGP_IO[61] eASICGP_IO[62] eASICGP_IO[63] eASICGP_IO[64] eASICGP_IO[65] eASICGP_IO[66] eASICGP_IO[67] eASICGP_IO[68] eASICGP_IO[69] eASICGP_IO[70] eASICGP_IO[71] eASICGP_IO[72] eASICGP_IO[73-74] eASICGP_IO[75-76] eASICGP_IO[77-78] eASICGP_IO[79-80] eASICGP_IO[81-82] eASICGP_IO[83-84] eASICGP_IO[85-86] eASICGP_IO[87-88] eASICGP_IO[89-90] eASICGP_IO[91-92] eASICGP_IO[93-94] eASICGP_IO[95-96] eASICGP_IO[97-98] eASICGP_IO[99] eASIC_EXT_CLOCK eASIC_PI_CLOCK Ethernet ...
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Pin description Table 2. Interface signals (continued) Group GPI/Os I2C JTAG Master clock Master reset MPMC MPMCDATA[00] MPMCDATA[01] MPMCDATA[02] MPMCDATA[03] 8/16 Signal Name Ball Direction TXD[2] D15 Output TXD[3] D16 TX_EN D17 CRS E15 Input COL E16 RX_CLK E17 Input ...
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SPEAR-09-H042 Table 2. Interface signals (continued) Group MPMCDATA[04] MPMCDATA[05] MPMCDATA[06] MPMCDATA[07] MPMCDATA[08] MPMCDATA[09] MPMCDATA[10] MPMCDATA[11] MPMCDATA[12] MPMCDATA[13] MPMCDATA[14] MPMCDATA[15] MPMCADDROUT[00] MPMCADDROUT[01] MPMCADDROUT[02] MPMCADDROUT[03] MPMCADDROUT[04] MPMCADDROUT[05] MPMCADDROUT[06] MPMCADDROUT[07] MPMCADDROUT[08] MPMCADDROUT[09] MPMCADDROUT[10] MPMCADDROUT[11] MPMCADDROUT[12] MPMCADDROUT[13] MPMCADDROUT[14] nMPMCDYCSOUT[0] nMPMCDYCSOUT[1] nMPMCDYCSOUT[2] nMPMCDYCSOUT[3] MPMCCKEOUT[0] MPMCCKEOUT[1] ...
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Pin description Table 2. Interface signals (continued) Group MPMCCLKOUT[1] nMPMCCLKOUT[1] MPMCDQMOUT[0] MPMCDQMOUT[1] nMPMCCASOUT nMPMCRASOUT nMPMCWEOUT RTC SMI UART USBs HOST1_VBUS HOST2_VBUS 10/16 Signal Name Ball Direction U14 U13 T16 Output U17 MPMCDQS[0] R16 Output MPMCDQS[1] R17 T6 Output U6 U5 ...
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SPEAR-09-H042 3.2 Power connections Table 3. Power connections Group vdd1v2_date_osci gnd_date_osci gnde_date_osci anavdd_3v3_pll1600 anagnd_3v3_pll1600 digvdd_1v2_pll1600 diggnd_1v2_pll1600 Power Signal Name Ball (1) vdd3v3 Digital 3.3V power (2) vdd Digital 1.2V power (3) gnd Digital ground vdd_dith P6 DDR / SDR dedicated ...
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Pin description Table 3. Power connections (continued) Group 1. Signal spread on the following balls: H11, J08, J09, J13, J14, K14, M14, N14, P14. 2. Signal spread on the following balls: H10, J07, J12, L14, N05, P09, P13. 3. Signal ...
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SPEAR-09-H042 3.3 Ballout top view Figure 1. Ballout top view SIC G eA SIC G eA SIC G eA SIC G eA SIC _IO _IO _IO[ 22 ...
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Package information 4 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the ...
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SPEAR-09-H042 5 Revision history Table 4. Document revision history Date 31-Jan-2008 Revision 1 Initial release. Revision history Changes 15/16 ...
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