SPEAR09H042 STMicroelectronics, SPEAR09H042 Datasheet - Page 14

• Manufacturer Part Number: SPEAR09H042
• Manufacturer: STMicroelectronics

Specifications of SPEAR09H042

• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Package Type: LFBGA
• Pin Count: 289
• Mounting: Surface Mount
• Rad Hardened: No
• Lead Free Status / RoHS Status: Supplier Unconfirmed

Package information
4
14/16
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 2.
DIM.
ddd
eee
A1
A2
A3
A4
D1
E1
fff
A
D
b
E
e
F
LFBGA289 mechanical data and package dimensions
14.850 15.000 15.150 0.5846 0.5906 0.5965
14.850 15.000 15.150 0.5846 0.5906 0.5965
0.270
0.350
MIN.
12.800
12.800
0.985
0.200
0.400
0.800
1.100
TYP.
mm
MAX.
1.700
0.800
0.450 0.0137 0.0157 0.0177
0.120
0.150
0.080
0.0106
MIN.
0.0387
0.0078
0.5039
0.5039
0.0315
0.0433
inch
TYP.
0.0669
0.0315
0.0047
0.0059
0.0031
MAX.
Low profile Fine Pitch Ball Grid Array
Body: 15 x 15 x 1.7mm
MECHANICAL DATA
OUTLINE AND
LFBGA289
SPEAR-09-H042
8077927 B