TCD1209D Toshiba, TCD1209D Datasheet
TCD1209D
Specifications of TCD1209D
Available stocks
Related parts for TCD1209D
TCD1209D Summary of contents
Page 1
... TOSHIBA CCD LINEAR IMAGE SENSOR CCD (Charge Coupled Device) The TCD1209D is a high speed and low dark current 2048 elements CCD image sensor. The sensor is designed for facsimile, imagescanner and OCR. The device contains a row of 2048 elements photodiodes which provide a 8 lines / mm (200 DPI) across a B4 size paper. The device is operated (pulse), and 12 V power supply ...
Page 2
... CIRCUIT DIAGRAM PIN NAMES 1 Clock (Phase 1) φ 2 Clock (Phase 2) φ 2B Final Stage Clock (Phase 2) φ SH Shift Gate RS Reset Gate CP Clamp Gate OS Signal Output OD Power SS Ground NC Non Connection 2 TCD1209D 2001-10-15 ...
Page 3
... DR ― 2000 ― V 4.0 5.5 7 ― 0.6 ― Dσ 100 % is maximum deviation from under uniform illumination. V SAT lx s · TCD1209D = 1MHz, φ UNIT NOTE V / (lx·s) % (Note 2) mV (Note 8) V (Note 3) lx·s (Note 4) mV (Note 5) mV (Note kΩ ― (Note 6) ...
Page 4
... So the shorter t INT condition makes wider DR values. Note 7: DC signal output voltage and DC compensation output voltage are defined as follows: Note 8: PRNU (3) is defined as maximum voltage with next pixel, where measured (Typ.) and V when V is maximum dark signal voltage. DRK MDK MDK 4 TCD1209D 2001-10-15 ...
Page 5
... The standard deviation of ∆V is calculated after procedure 2) and 3) are repeated 30 times (30 readings Procedure 2), 3) and 4) are repeated 10 times to get 10 sigma values σ value calculated using the above procedure is observed the ground level specify the random noise as follows. Random noise = σ TCD1209D times larger than that measured relative to 2 2001-10-15 ...
Page 6
... ― 0.5 4 ― 0.5 V 11.4 12.0 13.0 OD (Ta = 25°C) SYMBOL MIN TYP. MAX f ― φ f ― ― 200 ― φ ― 200 ― φ ― φ C ― 30 ― ― ― TCD1209D UNIT UNIT MHz MHz 2001-10-15 ...
Page 7
... TCD1209D 2001-10-15 ...
Page 8
... TIMING REQUIREMENTS NOTE 11: Each RS and CP pins put to Low level during this period 8 TCD1209D 2001-10-15 ...
Page 9
... TCD1209D UNIT 2001-10-15 ...
Page 10
... Soldering by the solder flow method cannot be guaranteed because this method may have deleterious effects on prevention of window glass soiling and heat resistance. Using a soldering iron, complete soldering within ten seconds for lead temperatures 260°C, or within three seconds for lead temperatures 350°C. 10 TCD1209D 2001-10-15 ...
Page 11
... PACKAGE DIMESIONS Note 1: No. 1 SENSOR ELEMENT (S1) TO EDGE OF PACKAGE. Note 2: TOP OF CHIP TO BOTTOM OF PACKAGE. Note 3: GLASS THICKNES (n = 1.5) 11 TCD1209D 2001-10-15 ...
Page 12
... TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. The information contained herein is subject to change without notice. 12 TCD1209D 000707EBA 2001-10-15 ...