MCIMX27VJP4AR2 Freescale, MCIMX27VJP4AR2 Datasheet - Page 110

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MCIMX27VJP4AR2

Manufacturer Part Number
MCIMX27VJP4AR2
Description
Manufacturer
Freescale
Datasheet

Specifications of MCIMX27VJP4AR2

Lead Free Status / RoHS Status
Compliant
Package Information and Pinout
5.2
Table 59 on page 111
Table 60 on page 116
list is sorted alphabetically by the name of the contact. The connections of these pins depend solely upon
the user application, however there are a few factory test signals that are not used in a normal application.
Following is a list of these signals and how they are to be terminated for proper operation of the
i.MX27/MX27L processor:
110
CLKMODE[1:0]: To ensure proper operation, leave these signals as no connects.
OSC26M_TEST: To ensure proper operation, leave this signal as no connect.
EXT_60M: To ensure proper operation, connect this signal to ground.
EXT_266M: To ensure proper operation, connect this signal to ground.
Most of the signals shown in
of the signals at a particular pad are shown in the form of a compound signal name. Please refer to
Table 3
Pin Assignments (17 mm × 17 mm)
for complete information on the signal multiplexing schemes of these signals.
shows the i.MX27 full 17 × 17 mm package MAPBGA pin assignments.
identifies the pin assignments for the ball grid array (BGA) for full package. The
i.MX27 and i.MX27L Data Sheet, Rev. 1.6
Table 59
are multiplexed with other signals. For ease of reference, all
Freescale Semiconductor

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