TSEV83102G0BGL E2V, TSEV83102G0BGL Datasheet - Page 17

• Manufacturer Part Number: TSEV83102G0BGL
• Manufacturer: E2V

Specifications of TSEV83102G0BGL

• Lead Free Status / RoHS Status: Not Compliant

Thermal and Moisture Characteristics
Dissipation by Conduction and Convection
2101D–BDC–06/04
The thermal resistance from junction to ambient RTH
RTH
conduction. The heat sink should be fixed in contact with the top side of the package (CuW
heat spreader over Al2O3) which is at -5V.
The heat sink needs to be electrically isolated, using adequate low RTH electrical isolation.
Example:
Assuming:
Note:
The thermal resistance from case to ambient RTH
still air) with the heat sink depicted in Figure 4 on page 18, of dimensions 50 mm x 50 mm
x 22 mm (respectively L x l x H).
The global junction to ambient thermal resistance RTH
4.35 C/W RTH
ent) = 10.35 C/W total (RTH
A typical thermal resistance from the junction to the bottom of the case RTH
4.35 C/W (finite element method thermal simulation results): this value does not include
the thermal contact resistance between the package and the external heat sink (glue,
paste, or thermal foil interface, for example). As an example, use a 2.0 C/W value for a
50 µm thickness of thermal grease.
JA
, it is mandatory to use an external heat sink to improve dissipation by convection and
Example of the calculation of the ambient temperature T
assuming RTH
= 110 - (10.35 x 4.6) = 62.39 C. T
air flow ( 2 m/s, for example).
JC
JA
+ 2.0 C/W thermal grease resistance + 4.0 C/W RTH
= 10.35 C/W and power dissipation = 4.6 W, T
JA
).
A
max can be increased by lowering RTH
JA
CA
is around 30 C/W. Therefore, to lower
is typically 4.0 C/W (0 m/s air flow or
A
JA
max to ensure T
is:
A
max = T
TS83102G0B
J
max = 110 C:
J
JA
CA
- (RTH
with an adequate
(case to ambi-
JA
x 4.6 W)
JC
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