TSEV83102G0BGL E2V, TSEV83102G0BGL Datasheet - Page 47

• Manufacturer Part Number: TSEV83102G0BGL
• Manufacturer: E2V

Specifications of TSEV83102G0BGL

• Lead Free Status / RoHS Status: Not Compliant

Configuration 2:
Junction Temperature
Diode Transfer
Function
2101D–BDC–06/04
Note:
Figure 53. Diode Pin Implementation of Die Junction Temperature Monitoring Function Only
The forward voltage drop (V
ture (including the chip’s parasitic resistance) is given in the following graph (I
Figure 54. Junction Temperature Versus Diode Voltage for l = 1 mA
In the preliminary specification, Atmel recommends the use of 2 x 3 head-to-tail protection
diodes.
9 4 0
9 3 0
9 2 0
9 0 0
8 9 0
8 8 0
8 6 0
8 4 0
8 3 0
8 2 0
8 0 0
9 50
8 70
8 50
79 0
9 10
8 10
-10
0
10
DIODE
2 0
), across the diode component, versus the junction tempera-
3 0
ADC Pin
GND
A10
4 0
50
6 0
70
Vdiode
VGND
Idiode
IGND
8 0
Jonction Temperature (°C)
TS83102G0B
9 0
V
10 0
1mA
DIODE
110
= 1 mA).
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