TSEV83102G0BGL E2V, TSEV83102G0BGL Datasheet - Page 46

• Manufacturer Part Number: TSEV83102G0BGL
• Manufacturer: E2V

Specifications of TSEV83102G0BGL

• Lead Free Status / RoHS Status: Not Compliant

External Configuration
Description
Configuration 1
46
TS83102G0B
When this function is active, the ADC outputs only 1 out of 32 bits of data, resulting in a data
rate 32 times slower than the clock rate.
Note:
Because of the use of one internal diode-mounted transistor (used for junction temperature
monitoring), you have to implement external head-to-tail protection diodes so as to avoid
potential reverse current flows, which can damage the internal diode component.
Two external configurations are possible:
•
•
This external configuration allows you to apply the requested levels to activate output data
decimation (V
explains why 7 protection diodes are needed in the other direction, as shown in Figure 51).
Figure 51. Recommended Diode Pin Implementation Allowing for Both Die Junction Temper-
ature Monitoring Function and Decimation Mode
Figure 52. Diode Pin Implementation for Decimation Activation
Configuration 1: allows both junction temperature monitoring and output data decimation.
Configuration 2: allows junction temperature monitoring only.
The ADC decimation test mode is different from the pattern generator function, which is used to
check the ADC’s outputs.
EE
= -5V) and at the same time monitor the junction temperature diode (this
ADC Pin
ADC Pin
Gnd
Gnd
A10
A10
VEE = -5 V
IGND
Idiode
Vdiode
VGND
V
1 mA
2101D–BDC–06/04