STM32F217ZGT6 STMicroelectronics, STM32F217ZGT6 Datasheet - Page 114

• Manufacturer Part Number: STM32F217ZGT6
• Description: MCU ARM 1024KB FLASH 144LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F217ZGT6

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, Ethernet, I²C, IrDA, LIN, MMC, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 114
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 132K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 24x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Cpu Family: STM32
• Device Core: ARM Cortex-M3
• Device Core Size: 32b
• Frequency (max): 120MHz
• Total Internal Ram Size: 132KB
• # I/os (max): 114
• Number Of Timers - General Purpose: 14
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• On-chip Dac: 2(2-chx12-bit)
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-11189

Electrical characteristics
Table 63.
1. Guaranteed by design, not tested in production.
2. Guaranteed by characterization, not tested in production.
114/158
INL
Offset
Gain
error
t
THD
Update
rate
t
PSRR+
SETTLING
WAKEUP
Symbol
(2)
(1)
(2)
(2)
(2)
(1)
(2)
(2)
Integral non linearity
(difference between
measured value at Code i
and the value at Code i on a
line drawn between Code 0
and last Code 1023)
Offset error
(difference between
measured value at Code
(0x800) and the ideal value =
V
Gain error
Settling time (full scale: for a
10-bit input code transition
between the lowest and the
highest input codes when
DAC_OUT reaches final
value ±4LSB
Total Harmonic Distortion
Buffer ON
Max frequency for a correct
DAC_OUT change when
small variation in the input
code (from code i to i+1LSB)
Wakeup time from off state
(Setting the ENx bit in the
DAC Control register)
Power supply rejection ratio
(to V
measurement)
DAC characteristics (continued)
REF+
DDA
/2)
) (static DC
Parameter
Min
-
-
-
-
-
-
-
-
-
-
-
Doc ID 17050 Rev 4
Typ
–67
6.5
3
-
-
-
-
-
-
-
-
Max
±0.5
±10
±12
–40
±1
±4
±3
10
6
1
-
MS/s
Unit
LSB
LSB
LSB
LSB
mV
dB
dB
µs
µs
%
Given for the DAC in 10-bit
configuration.
Given for the DAC in 12-bit
configuration.
Given for the DAC in 12-bit
configuration
Given for the DAC in 10-bit at
V
Given for the DAC in 12-bit at
V
Given for the DAC in 12-bit
configuration
C
R
C
R
C
R
C
input code between lowest and
highest possible ones.
No R
STM32F215xx, STM32F217xx
REF+
REF+
LOAD
LOAD
LOAD
LOAD
LOAD
LOAD
LOAD
LOAD
= 3.6 V
= 3.6 V
≤ 50 pF,
≥ 5 kΩ
≤ 50 pF,
≥ 5 kΩ
≤ 50 pF,
≥ 5 kΩ
≤ 50 pF, R
, C
Comments
LOAD
LOAD
= 50 pF
≥ 5 kΩ