STM32F217ZGT6 STMicroelectronics, STM32F217ZGT6 Datasheet - Page 83

• Manufacturer Part Number: STM32F217ZGT6
• Description: MCU ARM 1024KB FLASH 144LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F217ZGT6

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, Ethernet, I²C, IrDA, LIN, MMC, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 114
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 132K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 24x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Cpu Family: STM32
• Device Core: ARM Cortex-M3
• Device Core Size: 32b
• Frequency (max): 120MHz
• Total Internal Ram Size: 132KB
• # I/os (max): 114
• Number Of Timers - General Purpose: 14
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• On-chip Dac: 2(2-chx12-bit)
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-11189

STM32F215xx, STM32F217xx
5.3.12
Figure 33. PLL output clock waveforms in center spread mode
Figure 34. PLL output clock waveforms in down spread mode
Memory characteristics
Flash memory
The characteristics are given at T
Table 32.
1. TBD stands for “to be defined”.
I
DD
Symbol
Supply current
Flash memory characteristics
Parameter
Doc ID 17050 Rev 4
Read mode
f
V
Write / Erase modes
f
HCLK
HCLK
A
DD
=
= 3.3 V
–
= 120 MHz with 3 wait states,
= 120 MHz, V
40 to 105 °C unless otherwise specified.
Conditions
(1)
DD
= 3.3 V
Electrical characteristics
Min
-
-
Max
TBD
100
83/158
Unit
mA
mA