CS82C54 Intersil, CS82C54 Datasheet - Page 21

• Manufacturer Part Number: CS82C54
• Description: IC TIMER PROG CMOS 8MHZ 28-PLCC
• Manufacturer: Intersil
• Type: Programmable Timerr

Specifications of CS82C54

• Frequency: 8MHz
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Supply: 10mA
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 28-PLCC
• Peak Reflow Compatible (260 C): No
• Leaded Process Compatible: No
• Mounting Type: Surface Mount
• Rohs Compliant: No
• Number Of Leads: 28
• Operating Frequency: 8 MHz
• Package Type: PLCC
• Power, Standby: 5 V
• Technology: CMOS
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Count: -

j
E1
x 45
Ceramic Leadless Chip Carrier Packages (CLCC)
B
h x 45
E2
o
-E-
e
-F-
1
A
o
L
0.010
S
L2
E H
S
0.007
D3
D
D1
B1
21
M
-H-
D2
B2
E F
e
S H S
A1
L3
E3
0.010
PLANE 2
PLANE 1
B3
L1
E
S
E F
S
82C54
J28.A
28 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
NOTES:
SYMBOL
1. Metallized castellations shall be connected to plane 1 terminals
2. Unless otherwise specified, a minimum clearance of 0.015 inch
3. Symbol “N” is the maximum number of terminals. Symbols “ND”
4. The required plane 1 terminals and optional plane 2 terminals (if
5. The corner shape (square, notch, radius, etc.) may vary at the
6. Chip carriers shall be constructed of a minimum of two ceramic
7. Dimension “A” controls the overall package thickness. The maxi-
8. Dimensioning and tolerancing per ANSI Y14.5M-1982.
9. Controlling dimension: INCH.
ND
NE
A1
B1
B2
B3
D1
D2
D3
E1
E2
E3
and extend toward plane 2 across at least two layers of ceramic
or completely across all of the ceramic layers to make electrical
connection with the optional plane 2 terminals.
(0.38mm) shall be maintained between all metallized features
(e.g., lid, castellations, terminals, thermal pads, etc.)
and “NE” are the number of terminals along the sides of length
“D” and “E”, respectively.
used) shall be electrically connected.
manufacturer’s option, from that shown on the drawing.
layers.
mum “A” dimension is package height before being solder dipped.
e1
L1
L2
L3
A
B
D
E
N
e
h
L
j
MIL-STD-1835 CQCC1-N28 (C-4)
0.060
0.050
0.022
0.006
0.442
0.442
0.015
0.045
0.045
0.075
0.003
MIN
-
-
-
0.300 BSC
0.150 BSC
0.300 BSC
0.150 BSC
0.050 BSC
0.072 REF
0.040 REF
0.020 REF
INCHES
28
7
7
0.100
0.088
0.028
0.022
0.460
0.460
0.460
0.460
0.055
0.055
0.095
0.015
MAX
-
-
11.23
11.23
1.52
1.27
0.56
0.15
0.38
1.14
1.14
1.90
0.08
MIN
MILLIMETERS
-
-
-
1.83 REF
7.62 BSC
3.81 BSC
7.62 BSC
3.81 BSC
1.27 BSC
1.02 REF
0.51 REF
28
7
7
11.68
11.68
11.68
11.68
2.54
2.23
0.71
0.56
1.40
1.40
2.41
0.038
MAX
-
-
Rev. 0 5/18/94
NOTES
6, 7
2, 4
2
2
2
5
5
3
3
3
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-