AD7302BRZ Analog Devices Inc, AD7302BRZ Datasheet - Page 4

• Manufacturer Part Number: AD7302BRZ
• Description: IC DAC 8BIT DUAL R-R 20-SOIC
• Manufacturer: Analog Devices Inc

Specifications of AD7302BRZ

• Data Interface: Parallel
• Settling Time: 1.2µs
• Number Of Bits: 8
• Number Of Converters: 2
• Voltage Supply Source: Single Supply
• Power Dissipation (max): 24.8mW
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (7.5mm Width)
• Resolution (bits): 8bit
• Sampling Rate: 833kSPS
• Input Channel Type: Parallel
• Supply Voltage Range - Analog: 2.7V To 5.5V
• Supply Current: 2.8mA
• Digital Ic Case Style: SOIC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AD7302
ABSOLUTE MAXIMUM RATINGS*
(T
V
Reference Input Voltage to AGND . . . .–0.3 V to V
Digital Input Voltage to DGND . . . . . –0.3 V to V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, 0.3 V
V
Operating Temperature Range
Storage Temperature Range . . . . . . . . . . . . –65 C to +150 C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . .+150 C
Plastic DIP Package, Power Dissipation . . . . . . . . . . 900 mW
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7302 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
DD
OUT
A
Commercial (B Version) . . . . . . . . . . . . . –40 C to +105 C
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . +260 C
= +25 C unless otherwise noted)
JA
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
A, V
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 102 C/W
OUT
B to AGND . . . . . . . . . . . . –0.3 V, V
Model
AD7302BN
AD7302BR
AD7302BRU
*N = Plastic DIP; R = Small Outline; RU =Thin Shrink Small Outline.
DD
DD
DD
+ 0.3 V
+ 0.3 V
+ 0.3 V
ORDERING GUIDE
Temperature
Range
–40 C to +105 C
–40 C to +105 C
–40 C to +105 C
–4–
TSSOP Package, Power Dissipation . . . . . . . . . . . . . 700 mW
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 870 mW
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Lead Temperature, Soldering
Lead Temperature, Soldering
JA
JA
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . +215 C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . .+220 C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . +215 C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . .+220 C
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 143 C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 74 C/W
Package
Options*
N-20
R-20
RU-20
WARNING!
ESD SENSITIVE DEVICE
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