MT48LC8M32B2P-6 Micron Technology Inc, MT48LC8M32B2P-6 Datasheet - Page 32

MT48LC8M32B2P-6

Manufacturer Part Number
MT48LC8M32B2P-6
Description
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48LC8M32B2P-6

Organization
8Mx32
Density
256Mb
Address Bus
14b
Access Time (max)
17/7.5/5.5ns
Maximum Clock Rate
166MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
165mA
Pin Count
86
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Compliant

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10. For a READ without auto precharge interrupted by a READ (with or without auto precharge), the READ to bank m will
11. For a READ without auto precharge interrupted by a WRITE (with or without auto precharge), the WRITE to bank m will
12. For a WRITE without auto precharge interrupted by a READ (with or without auto precharge), the READ to bank m will
13. For a WRITE without auto precharge interrupted by a WRITE (with or without auto precharge), the WRITE to bank m
14. For a READ with auto precharge interrupted by a READ (with or without auto precharge), the READ to bank m will
15. For a READ with auto precharge interrupted by a WRITE (with or without auto precharge), the WRITE to bank m will
16. For a WRITE with auto precharge interrupted by a READ (with or without auto precharge), the READ to bank m will
17. For a WRITE with auto precharge interrupted by a WRITE (with or without auto precharge), the WRITE to bank m will
09005aef8140ad6d
MT48LC8M32B2_2.fm - Rev. B 10/04 EN
7. READs or WRITEs to bank m listed under Command (Action) include READs or WRITEs with auto precharge enabled and
8. CONCURRENT AUTO PRECHARGE: Bank n will initiate the auto precharge command when its burst has been interrupted
9. Burst in bank n continues as initiated.
READs or WRITEs with auto precharge disabled.
by bank m’s burst.
interrupt the READ on bank n, CAS latency later (Figure 9).
interrupt the READ on bank n when registered (Figures 12 and 13). DQM should be used one clock prior to the WRITE
command to prevent bus contention.
interrupt the WRITE on bank n when registered (Figure 20), with the data-out appearing CAS latency later. The last valid
WRITE to bank n will be data-in registered one clock prior to the READ to bank m.
will interrupt the WRITE on bank n when registered (Figure 18). The last valid WRITE to bank n will be data-in registered
one clock prior to the READ to bank m.
interrupt the READ on bank n, CAS latency later. The PRECHARGE to bank n will begin when the READ to bank m is reg-
istered (Figure 24).
interrupt the READ on bank n when registered. DQM should be used two clocks prior to the WRITE command to prevent
bus contention. The PRECHARGE to bank n will begin when the WRITE to bank m is registered (Figure 28).
interrupt the WRITE on bank n when registered, with the data-out appearing CAS latency later. The PRECHARGE to
bank n will begin after
bank n will be data-in registered one clock prior to the READ to bank m (Figure 29).
interrupt the WRITE on bank n when registered. The PRECHARGE to bank n will begin after
begins when the WRITE to bank m is registered. The last valid WRITE to bank n will be data registered one clock prior to
the WRITE to bank m (Figure 30).
t
WR is met, where
t
WR begins when the READ to bank m is registered. The last valid WRITE to
32
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003 Micron Technology, Inc. All rights reserved.
t
WR is met, where
256Mb: x32
SDRAM
t
WR

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