EWIXP425BBT Intel, EWIXP425BBT Datasheet - Page 49

• Manufacturer Part Number: EWIXP425BBT
• Manufacturer: Intel

Specifications of EWIXP425BBT

• Core Operating Frequency: 266MHz
• Package Type: BGA
• Pin Count: 492
• Mounting: Surface Mount
• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Compliant

Intel
4.0
4.1
Figure 7.
August 2006
Document Number: 252479-006US
1.
2.
3.
45º Chamfer
®
IXP42X product line and IXC1100 control plane processors
4 Places
22.00 REF
All measurements are in millimeters (mm).
The size of the land pad at the interposer side (1) is 0.81 mm.
The size of the solder resist at the interposer side (2) is 0.66 mm.
Package and Pinout Information
The Intel
Processor have a 492-ball, plastic ball grid array (PBGA) package for commercial-
temperature applications and a pin-for-pin, compatible 492-ball, plastic ball grid array
with a drop-in heat spreader (H) for extended-temperature applications.
Package Description
492-Pin Lead PBGA Package
0.127 A
TOP VIEW
35.00 ± 0.20
30.00 ± 0.25
22.00 REF
Pin 1 ID
®
0.61 ± 0.06
IXP42X Product Line of Network Processors and IXC1100 Control Plane
2.38 ± 0.21
Intel
-A-
30.00 ± 0.25
®
0.60 ± 0.10
IXP42X Product Line of Network Processors and IXC1100 Control Plane Processor
1.17 ± 0.05
35.00 ± 0.20
-B-
SIDE VIEW
ø
0.30
30º
S
3 Places
2
3
Seating Plane
C
1.63 REF
A
ø1.0
S
ø
B S
1.27
0.90
0.60
0.20
0.15
C
26
+
+
+
25
-C-
24
23
22
1.63 REF
21
20
19
18
17
16
15
14
(1)
13
12
1.27
11
10
9
8
7
6
+ +
5
4
3
2
1
AA
AB
AC
AD
AE
AF
B
C
D
E
F
G
H
K
L
M
N
P
R
U
W
A
J
T
V
Y
B1268-03
Pin #1
Corner
(2)
Datasheet
49