MCC501RX200TD0B Freescale Semiconductor, MCC501RX200TD0B Datasheet - Page 72

• Manufacturer Part Number: MCC501RX200TD0B
• Manufacturer: Freescale Semiconductor

Specifications of MCC501RX200TD0B

• Package Type: BGA
• Mounting: Surface Mount
• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Not Compliant

72
C5NP
AC Timing Specifications
CHAPTER 3: ELECTRICAL SPECIFICATIONS
3 Effective Thermal Resistance (φ
Figure 10 Thermal Performance for C-5 Network Processor Heat Sink (see
AC timing specifications consist of input requirements and output responses. The input
requirements include setup and hold times, pulse widths, and high and low times. The
output responses include delays from clock to signal. The AC timing specifications are
defined separately for each interface to the C-5 NP
Unless otherwise noted, all AC specifications were tested within the functional operating
range.
performance of the heat sink and board, as outlined in Note 2 above.
– Dimensions: 100mm x 80mm x 10mm (height)
– Thermal resistance heat sink to ambient (φ
– Thermal resistance case to heat sink (φ
– Note that target heat sink design is for low profile (10mm height) applications.
provides the characteristic thermal resistance curve for this heat sink for various
airflow rates.
thermal material).
Significantly better thermal performance is possible with taller and/or wider
designs. Contact your C-Port representative for heat sink options.
effective
= φ
JA
φ
JBA
CS
/ (φ
) of 0.03
SA
JA
) of 1.6
+ φ
o
JBA
C/W (Chromerics T705
o
)) reflects the total thermal
C/W @200 LFM.
step 2
above)
Figure 10