MCC501RX200TD0B Freescale Semiconductor, MCC501RX200TD0B Datasheet - Page 72
MCC501RX200TD0B
Manufacturer Part Number
MCC501RX200TD0B
Description
Manufacturer
Freescale Semiconductor
Datasheet
1.MCC501RX200TD0B.pdf
(100 pages)
Specifications of MCC501RX200TD0B
Package Type
BGA
Mounting
Surface Mount
Operating Temperature (min)
-40C
Operating Temperature Classification
Industrial
Lead Free Status / Rohs Status
Not Compliant
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Quantity
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Part Number:
MCC501RX200TD0B
Manufacturer:
FREESCALE
Quantity:
20 000
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72
C5NP
AC Timing Specifications
CHAPTER 3: ELECTRICAL SPECIFICATIONS
3 Effective Thermal Resistance (φ
Figure 10 Thermal Performance for C-5 Network Processor Heat Sink (see
AC timing specifications consist of input requirements and output responses. The input
requirements include setup and hold times, pulse widths, and high and low times. The
output responses include delays from clock to signal. The AC timing specifications are
defined separately for each interface to the C-5 NP
Unless otherwise noted, all AC specifications were tested within the functional operating
range.
performance of the heat sink and board, as outlined in Note 2 above.
– Dimensions: 100mm x 80mm x 10mm (height)
– Thermal resistance heat sink to ambient (φ
– Thermal resistance case to heat sink (φ
– Note that target heat sink design is for low profile (10mm height) applications.
provides the characteristic thermal resistance curve for this heat sink for various
airflow rates.
thermal material).
Significantly better thermal performance is possible with taller and/or wider
designs. Contact your C-Port representative for heat sink options.
effective
= φ
JA
φ
JBA
CS
/ (φ
) of 0.03
SA
JA
) of 1.6
+ φ
o
JBA
C/W (Chromerics T705
o
)) reflects the total thermal
C/W @200 LFM.
step 2
above)
Figure 10
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