ANXL1250FYC3F AMD (ADVANCED MICRO DEVICES), ANXL1250FYC3F Datasheet - Page 53

• Manufacturer Part Number: ANXL1250FYC3F
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of ANXL1250FYC3F

• Lead Free Status / Rohs Status: Compliant

Electrical Specifications
Note 1. V
Note 2. The selection of a 1.2V break in the V
Note 3. Measured at V
AMD Geode™ NX Processors Data Book
Symbol
V
I
I
V
V
I
I
C
R
R
R
VREF_LEAK_P
VREF_LEAK_N
LEAK_P
LEAK_N
REF
IH
IL
ON
IN
setP
setN
tion. V
to the ±50 mV specification listed above.
tolerances at lower voltage to maintain noise margin.
REF
is nominally set to 50% of V
REF
Parameter
DC Input Reference
Voltage (Note 1)
V
Leakage Pull-up
V
Leakage Pull-down
Input High Voltage
Input Low Voltage
TRI-STATE Leakage
Pull-up
TRI-STATE Leakage
Pull-down
Input Pin Capacitance
Output Resistance
(Note 3)
Impedance Set Point,
P Channel (Note 3)
Impedance Set Point,
N Channel (Note 3)
REF
REF
must be created with a sufficiently accurate DC source and a sufficiently quiet AC response to adhere
TRI-STATE
TRI-STATE
CC_CORE
Table 5-9. AMD Processor System Bus DC Characteristics
/2.
Condition
V
V
1.20V ≤ V
(Note 2)
V
(Note 2)
1.20V ≤ V
(Note 2)
V
(Note 2)
V
V
Nominal
CC_CORE
IN
IN
CC_CORE
CC_CORE
IN
IN
= V
= V
= V
= V
IH
REF
REF
SS
CC_CORE
and V
CC_CORE
CC_CORE
with actual values that are specific to circuit board design implementa-
(Ground)
< 1.20V
< 1.20V
Nominal
Nominal
IL
parameters is somewhat arbitrary, reflecting the need for tighter
(0.5 x V
0.90 x R
V
V
REF
REF
CC_CORE
–100
–300
–300
–250
Min
40
40
+ 200
+ 100
setN,P
) – 50 (0.5 x V
31177H
V
V
CC_CORE
CC_CORE
1.1 x R
V
V
REF
REF
CC_CORE
Max
100
250
70
70
7
– 200
– 100
setN,P
+ 500
+ 500
) + 50
Units
mV
mV
mV
mV
mV
μA
μA
μA
μA
pF
Ω
Ω
Ω
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