PNX1701EH,557 NXP Semiconductors, PNX1701EH,557 Datasheet - Page 468
PNX1701EH,557
Manufacturer Part Number
PNX1701EH,557
Description
Manufacturer
NXP Semiconductors
Datasheet
1.PNX1701EH557.pdf
(832 pages)
Specifications of PNX1701EH,557
Operating Temperature (min)
0C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Lead Free Status / Rohs Status
Not Compliant
- Current page: 468 of 832
- Download datasheet (9Mb)
Philips Semiconductors
Volume 1 of 1
PNX17XX_SER_1
Preliminary data sheet
1.2 FGPO to VDO pin mapping
1.3 DTL MMIO Interface
1.4 Header Initiator
1.5 Data Initiator
1.6 Record Output Mode
fgpo_start (fgpo_rec_start) maps to VDO_D[32]
fgpo_stop (fgpo_buf_start) maps to VDO_D[32]
fgpo_clk from clock module maps to VDO_C2
VDO_D[31:0] mapping depends on the VDO_MODE (Output Router) register
settings, see
This block contains all of the programmable registers used by the FGPO module
accessed through the MMIO bus. Refer to
block also handles clock domain crossing between the MMIO bus clock and the
FGPO module clock.
If either FGPO_CTL.TSTAMP_SELECT or FGPO_CTL.VAR_LENGTH bits are set
this DTL Initiator will read the record/message Timestamp and Variable Length fields.
The Variable Length information is passed on to the DMA Engine to issue a read
request from memory. The Timestamp information is passed to the Data Output
Engine for a timestamp trigger point. The MTL DTL Adapter for this DTL port contains
a 2x8 (16 byte) FIFO.
Issues main memory read requests for all data samples. The MTL DLT Adapter for
this DTL port contains a 128x8 (1024 byte) FIFO.
This mode allows the FGPO to read and transmit structured record data from main
memory to the outside world. The start of a record may be triggered by reaching an
absolute time (Timestamp), by expiration of a counted gap between records, or by a
synchronized external transition on the fgpo_rec_sync pin.
The switching of buffers may also be triggered by a synchronized external transition
on the fgpo_buf_sync pin.
A record start control signal is generated at the start of each record on the fgpo_start
(fgpo_rec_start) pin.
Output starts from a new location in the buffer for each record. Successive records
are output until the programmed number of records in a buffer is exhausted, then the
alternate buffer is used.
A buffer start control signal is generated at the start of each new buffer on the
fgpo_stop (fgpo_buf_start) pin.
This allows the output of video frames consisting of multiple line records,
synchronized by a frame or field synchronization signal.
Chapter 3 System On Chip
Rev. 1 — 17 March 2006
Chapter 13: FGPO: Fast General Purpose Output
Resources.
Section 4.
for registers description. This
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
PNX17xx Series
13-3
Related parts for PNX1701EH,557
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The XA-S3 device is a member of Philips Semiconductors? XA(eXtended Architecture) family of high performance 16-bitsingle-chip microcontrollers
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3152 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3154 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet: