MT47H128M16HG-37E:A TR Micron Technology Inc, MT47H128M16HG-37E:A TR Datasheet - Page 22
MT47H128M16HG-37E:A TR
Manufacturer Part Number
MT47H128M16HG-37E:A TR
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet
1.MT47H128M16HG-37EA_TR.pdf
(134 pages)
Specifications of MT47H128M16HG-37E:A TR
Organization
128Mx16
Address Bus
17b
Access Time (max)
500ps
Maximum Clock Rate
533MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
0C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
195mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Compliant
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Figure 11: 60-Ball FBGA Package (9mm x 11.5mm) – x4, x8
PDF: 09005aef824f87b6
2gbddr2.pdf – Rev. E 06/10 EN
Solder ball material:
SAC305 (96.5% Sn,
3% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-
reflow on Ø0.35
SMD ball pads.
Seating
60X Ø0.45
plane
8 CTR
0.12 A
0.8 TYP
Note:
A
9 8 7
1. All dimensions are in millimeters.
1.8 CTR
6.4 CTR
0.8 TYP
9 ±0.1
3 2 1
A
B
C
D
E
F
G
H
J
K
L
0.8 ±0.05
22
Ball A1 ID
11.5 ±0.1
0.155
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2Gb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.2 MAX
© 2006 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging
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