FHDFEET Intel, FHDFEET Datasheet - Page 30

• Manufacturer Part Number: FHDFEET
• Manufacturer: Intel

Specifications of FHDFEET

• Lead Free Status / Rohs Status: Supplier Unconfirmed

To ensure proper cooling, only processors with passive heatsinks should be used unless otherwise
indicated in the server board manuals. The ducting shown in Figure 19 is designed to work with the
passive heatsink included with the Intel
Air flows through the system from front to back. The heatsink solution used for the HSRP version
of the SC5200 chassis is provided with the Intel
mechanism, heatsink, clips, and thermal interface (grease) are used. The plastic PWT and fans
should not be installed. Note the direction of the fan airflow.
20
650W power supply
80x38mm
Hot-Swap FanS
PCI cards
Figure 20. Redundant Chassis Airflow Characteristics
Memory
Figure 19. Processor and PCI Area Ducting
92x25mm Hot-Swap fans x2
Processors with
Passive Heatsinks
®
Boxed Xeon
Air Flow
®
Boxed Xeon
TM
processors.
Plastic Fan Holder
TM
processors. Only the retention
Other 5.25" Drive
Floppy Drive
IDE drives
CDROM drive
5 Hotswap Hard Drives
80x38mm
Hot-Swap Fan
Revision 1.0