FHDFEET Intel, FHDFEET Datasheet - Page 40

• Manufacturer Part Number: FHDFEET
• Manufacturer: Intel

Specifications of FHDFEET

• Lead Free Status / Rohs Status: Supplier Unconfirmed

The hot-swap SCSI backplane board set resides in the hot-swap drive bay which is included with
the SC5200 650-W redundant chassis and/or is available as an upgrade.
5.10.3
5.11 SAF-TE Specifications
The SC5100/SC5200 hot-swap SCSI backplane board set performs the tasks associated with hot-
swappable SCSI drives, enclosure (chassis) monitoring and management, as specified in the
SCSI-Accessed Fault-Tolerant Enclosures Specification (SAF-TE), Revision 1.0. The SAF-TE
specified features supported by the hot-swap SCSI backplane include, but are not limited to, the
following:
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Fault indicator support
Support for two cooling fans (fan-tach inputs and power control)
Temperature sensor
Monitoring the SCSI bus for enclosure services messages, and acting on them
appropriately. Examples of such messages include: activate a drive fault indicator, power
down a drive that has failed, and report backplane temperature.
SAF-TE intelligent agent, which acts as proxy for “dumb” I
mastering capability) during intra-chassis communications.
SAF-TE Board Layout
Figure 26. SC5100/SC5200 SAF-TE Board
2
C devices (that have no bus
Revision 1.0