MT41J256M8HX-15E IT:D Micron Technology Inc, MT41J256M8HX-15E IT:D Datasheet - Page 97

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MT41J256M8HX-15E IT:D

Manufacturer Part Number
MT41J256M8HX-15E IT:D
Description
MICMT41J256M8HX-15E_IT:D 2GB DDR3 SDRAM
Manufacturer
Micron Technology Inc
Type
DDR3 SDRAMr
Datasheet

Specifications of MT41J256M8HX-15E IT:D

Organization
256Mx8
Address Bus
18b
Maximum Clock Rate
1.333GHz
Operating Supply Voltage (typ)
1.5V
Package Type
FBGA
Operating Temp Range
-40C to 95C
Operating Supply Voltage (max)
1.575V
Operating Supply Voltage (min)
1.425V
Supply Current
165mA
Pin Count
78
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / Rohs Status
Compliant
Command and Address Setup, Hold, and Derating
Table 58: Command and Address Setup and Hold Values Referenced at 1 V/ns – AC/DC-Based
PDF: 09005aef826aaadc
2Gb_DDR3_SDRAM.pdf – Rev. K 04/10 EN
t
t
t
t
t
IH (base) DC100
IS (base) AC175
IS (base) AC150
IS (base) AC135
IS (base) AC125
Symbol
DDR3-800
200
350
275
The total
sheet
(page 78)) to the Δ
(page 98)), respectively. Example:
transition, the input signal has to remain above/below V
t
Although the total setup time for slow slew rates might be negative (for example, a valid
input signal will not have reached V
tion), a valid input signal is still required to complete the transition and to reach V
V
between the values listed in Table 60 (page 98) and Table 63 (page 100), the derating
values may be obtained by linear interpolation.
Setup (
last crossing of V
for a falling signal is defined as the slew rate between the last crossing of V
the first crossing of V
rate line between the shaded “V
rating value (see Figure 33 (page 101)). If the actual signal is later than the nominal slew
rate line anywhere between the shaded “V
gent line to the actual signal from the AC level to the DC level is used for derating value
(see Figure 35 (page 103)).
Hold (
last crossing of V
for a falling signal is defined as the slew rate between the last crossing of V
the first crossing of V
rate line between the shaded “DC-to-V
rating value (see Figure 34 (page 102)). If the actual signal is earlier than the nominal
slew rate line anywhere between the shaded “DC-to-V
tangent line to the actual signal from the DC level to the V
ing value (see Figure 36 (page 104)).
VAC (see Table 60 (page 98)).
IL(AC)
DDR3-1066
t
t
IS (base) and
(see Figure 14 (page 50) for input signal requirements). For slew rates which fall
IH) nominal slew rate for a rising signal is defined as the slew rate between the
t
IS) nominal slew rate for a rising signal is defined as the slew rate between the
125
275
200
t
IS (setup time) and
REF(DC)
IL(DC)max
t
DDR3-1333
IS and Δ
Command and Address Setup, Hold, and Derating
t
IH (base) values (see Table 58; values come from Table 56
IL(AC)max
REF(DC)
190
140
65
and the first crossing of V
and the first crossing of V
t
. If the actual signal is always later than the nominal slew
IH derating values (see Table 59 (page 98) and Table 60
. If the actual signal is always earlier than the nominal slew
97
t
IH (hold time) required is calculated by adding the data
REF(DC)
DDR3-1600
t
IS (total setup time) =
IH(AC)
170
120
45
-to-AC region,” use the nominal slew rate for de-
REF(DC)
Micron Technology, Inc. reserves the right to change products or specifications without notice.
/V
REF(DC)
IL(AC)
region,” use the nominal slew rate for de-
2Gb: x4, x8, x16 DDR3 SDRAM
DDR3-1866
at the time of the rising clock transi-
-to-AC region,” the slew rate of a tan-
IH(AC)min
150
100
REF(DC)
65
REF(DC)
IH(AC)
t
IS (base) + Δ
. Setup (
. Hold (
REF(DC)
region,” the slew rate of a
/V
© 2006 Micron Technology, Inc. All rights reserved.
Units
IL(AC)
ps
ps
ps
ps
ps
level is used for derat-
t
IH) nominal slew rate
t
IS) nominal slew rate
for some time
t
IS. For a valid
V
V
V
V
V
REF(DC)
IH(DC)min
Reference
IH(AC)
IH(AC)
IH(AC)
IH(AC)
IH(DC)
/V
/V
/V
/V
/V
and
IL(AC)
IL(AC)
IL(AC)
IL(AC)
IL(DC)
IH(AC)
and
/

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