MT41J64M16JT-125:G Micron Technology Inc, MT41J64M16JT-125:G Datasheet - Page 28
![no-image](/images/manufacturer_photos/0/4/441/micron_technology_inc_sml.jpg)
MT41J64M16JT-125:G
Manufacturer Part Number
MT41J64M16JT-125:G
Description
MICMT41J64M16JT-125:G 64X16 1GB DDR3
Manufacturer
Micron Technology Inc
Series
-r
Type
DDR3 SDRAMr
Specifications of MT41J64M16JT-125:G
Format - Memory
RAM
Memory Type
DDR3 SDRAM
Memory Size
1G (64M x 16)
Speed
800MHz
Interface
Parallel
Voltage - Supply
1.425 V ~ 1.575 V
Operating Temperature
0°C ~ 95°C
Package / Case
96-TFBGA
Organization
64Mx16
Density
1Gb
Address Bus
16b
Operating Supply Voltage (typ)
1.5V
Package Type
FBGA
Operating Temp Range
0C to 95C
Operating Supply Voltage (max)
1.575V
Operating Supply Voltage (min)
1.425V
Pin Count
96
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT41J64M16JT-125:G
Manufacturer:
TRXCOM
Quantity:
30 000
Company:
Part Number:
MT41J64M16JT-125:G
Manufacturer:
MICRON
Quantity:
6 550
Company:
Part Number:
MT41J64M16JT-125:G
Manufacturer:
MICRON33
Quantity:
1 935
Company:
Part Number:
MT41J64M16JT-125:G
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT41J64M16JT-125:G
Manufacturer:
MICRON/美光
Quantity:
20 000
Thermal Characteristics
Table 8:
Figure 13: Thermal Measurement Point
PDF: 09005aef826aa906/Source: 09005aef82a357c3
1Gb_DDR3_D2.fm - Rev. F 11/08 EN
Thermal Characteristics
Notes:
1. MAX operating case temperature. T
2. A thermal solution must be designed to ensure the DRAM device does not exceed the maxi-
3. Device functionality is not guaranteed if the DRAM device exceeds the maximum T
4. If T
5. The thermal resistance data is based off of a number of samples from multiple lots and
Parameter/Condition
Operating case temperature
Junction-to-case (TOP)
L
Figure 13
mum T
operation.
interval refresh rate. The use of SRT or ASR (if available) must be enabled.
should be viewed as a typical number.
C
(L/2)
exceeds 85°C, the DRAM must be refreshed externally at 2X refresh, which is a 3.9µs
C
during operation.
).
W
28
(W/2)
78-ball
86-ball
96-ball
C
is measured in the center of the package (see
Micron Technology, Inc., reserves the right to change products or specifications without notice.
T c test point
1Gb: x4, x8, x16 DDR3 SDRAM
Symbol
ΘJC
T
T
C
C
Thermal Characteristics
0 to 85
0 to 95
Value
3.2
2.8
2.8
©2006 Micron Technology, Inc. All rights reserved.
Units
°C/W
°C
°C
1, 2, 3, 4
C
Notes
1, 2, 3
during
5