ST72F324BK6TAS STMicroelectronics, ST72F324BK6TAS Datasheet - Page 178

• Manufacturer Part Number: ST72F324BK6TAS
• Description: 8-BIT MCU
• Manufacturer: STMicroelectronics

Package characteristics
13.3
13.4
13.5
178/198
Thermal characteristics
Table 115. Thermal characteristics
1. The maximum power dissipation is obtained from the formula P
2. The maximum chip-junction temperature is based on technology characteristics.
Ecopack information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
Packaging for automatic handling
The devices can be supplied in trays or with tape and reel conditioning.
Tape and reel conditioning can be ordered with pin 1 left-oriented or right-oriented when
facing the tape sprocket holes as shown in
Figure 89. pin 1 orientation in tape and reel conditioning
See also
and
of an application can be defined by the user with the formula: P
internal power (I
application.
Symbol
Figure 91: ST72P324Bxx-Auto FastROM commercial product structure on page
T
R
Jmax
P
thJA
D
Figure 90: ST72F324Bxx-Auto Flash commercial product structure on page 182
®
®
packages, depending on their level of environmental compliance. ECOPACK
is an ST trademark.
Pin 1
Package thermal resistance (junction to ambient):
LQFP44 10x10
LQFP32 7x7
Power dissipation
Maximum junction temperature
DD
x V
Left orientation
DD
) and P
PORT
Doc ID13466 Rev 4
(1)
is the port power dissipation depending on the ports used in the
Ratings
Figure
(2)
89.
Right orientation (EIA 481-C compliant)
D
D
= P
= (T
INT
J
-T
+ P
A
) / R
PORT
thJA
where P
. The power dissipation
Pin 1
Value
500
150
52
70
ST72324B-Auto
INT
is the chip
°C/W
184.
Unit
mW
°C
®