DSPB56725AF Freescale Semiconductor, DSPB56725AF Datasheet - Page 43
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DSPB56725AF
Manufacturer Part Number
DSPB56725AF
Description
DSP 24BIT AUD 250MHZ 80-LQFP
Manufacturer
Freescale Semiconductor
Series
Symphony™r
Type
Audio Processorr
Specifications of DSPB56725AF
Interface
Host Interface, I²C, SAI, SPI
Clock Rate
250MHz
Non-volatile Memory
External
On-chip Ram
112kB
Voltage - I/o
3.30V
Voltage - Core
1.20V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
80-LQFP
Processor Series
DSP567xx
Core
56300
Leaded Process Compatible
Yes
Rohs Compliant
Yes
Peak Reflow Compatible (260 C)
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPB56725AF
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
FIGURE NOTES:
1
2
3
4
5
6
7
Freescale Semiconductor
All dimensions are in millimeters.
Interpret dimensions and tolerances per ASME Y.14.5M–1994
Datums B, C and D to be determined at datum plane H.
The top package body size may be smaller than the bottom package size by a maximum of 0.1 mm.
These dimensions do not include mold protrusions. The maximum allowable protrusion is 0.25 mm per side. These dimensions
are maximum body size dimensions including mold mismatch.
This dimension does not include dam bar protrusion. Protrusions shall not cause the lead width to exceed 0.35 mm. Minimum
space between protrusion and an adjacent lead shall be 0.07 mm.
These dimensions are determined at the seating plane, datum A.
Symphony
Figure 33. 144-Pin Package Outline Drawing (continued)
™
DSP56724/ DSP56725 Multi-Core Audio Processors, Rev. 2
43