DSPB56725AF Freescale Semiconductor, DSPB56725AF Datasheet - Page 45

• Manufacturer Part Number: DSPB56725AF
• Description: DSP 24BIT AUD 250MHZ 80-LQFP
• Manufacturer: Freescale Semiconductor
• Series: Symphony™r
• Type: Audio Processorr

Specifications of DSPB56725AF

• Interface: Host Interface, I²C, SAI, SPI
• Clock Rate: 250MHz
• Non-volatile Memory: External
• On-chip Ram: 112kB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.20V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 80-LQFP
• Processor Series: DSP567xx
• Core: 56300
• Leaded Process Compatible: Yes
• Rohs Compliant: Yes
• Peak Reflow Compatible (260 C): Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

FIGURE NOTES:
1
2
3
4
5
6
7
Freescale Semiconductor
Dimensioning and tolerancing per ASME Y.14.5M–1994.
Controlling dimension: millimeter.
Data plane H is located at the bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom
of the parting line.
Datum E, F and to be determined at datum plane H.
Dimensions to be determined at seating plane C.
Dimensions do not include mold protrusion. Allowable protrusion is 0.25 mm per side. Dimensions include mold mismatch and
are determined at datum plane H.
Dimension does not include dambar protrusion Dambar protrusion shall not cause the lead width to exceed 0.46 mm. Minimum
space between protrusion and adjacent lead or protrusion is 0.07mm.
Symphony
Figure 35. 80-Pin Package Outline Drawing (continued)
™
DSP56724/ DSP56725 Multi-Core Audio Processors, Rev. 2
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