MPC870CVR133 Freescale Semiconductor, MPC870CVR133 Datasheet - Page 79

• Manufacturer Part Number: MPC870CVR133
• Description: IC MPU POWERQUICC 133MHZ 256PBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICCr

Specifications of MPC870CVR133

• Processor Type: MPC8xx PowerQUICC 32-Bit
• Speed: 133MHz
• Voltage: 3.3V
• Mounting Type: Surface Mount
• Package / Case: 256-PBGA
• Processor Series: MPC8xx
• Core: MPC8xx
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 133 MHz
• Operating Supply Voltage: 0 V to 5 V
• Maximum Operating Temperature: + 100 C
• Mounting Style: SMD/SMT
• Data Ram Size: 8 KB
• I/o Voltage: 5 V
• Interface Type: I2C, SPI, UART
• Minimum Operating Temperature: - 40 C
• Program Memory Size: 8 KB
• Program Memory Type: EPROM/Flash
• Core Size: 32 Bit
• Cpu Speed: 133MHz
• Digital Ic Case Style: BGA
• No. Of Pins: 256
• Supply Voltage Range: 1.7V To 1.9V
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

16.2
Figure 70
Freescale Semiconductor
.
Figure 70. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M—1994.
3. MAXIMUM SOLDER BALL DIAMETER MEASURED PARALLEL TO DATUM A.
4. DATUM A, THE SEATING PLANE, IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
Note:
NOTES:
Mechanical Dimensions of the PBGA Package
shows the mechanical dimensions of the PBGA package.
Solder sphere composition is 95.5%Sn 45%Ag 0.5%Cu for MPC875/MPC870VRXXX.
Solder sphere composition is 62%Sn 36%Pb 2%Ag for MPC875/MPC870ZTXXX.
MPC875/MPC870 PowerQUICC™ Hardware Specifications, Rev. 4
Mechanical Data and Ordering Information
79