NE1619DS NXP Semiconductors, NE1619DS Datasheet - Page 14

no-image

NE1619DS

Manufacturer Part Number
NE1619DS
Description
Board Mount Temperature Sensors I2C LOC +/-3 AND REM +/-5 TS W/VM
Manufacturer
NXP Semiconductors
Datasheet

Specifications of NE1619DS

Full Temp Accuracy
+/- 2 C , +/- 3 C
Package / Case
SSOP-16
Digital Output - Bus Interface
2-Wire
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
0 C
Output Type
Digital
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
NE1619DS,112

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NE1619DS
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Company:
Part Number:
NE1619DS
Quantity:
5 000
Part Number:
NE1619DSЈ¬112
Manufacturer:
NXP
Quantity:
1 290
Philips Semiconductors
NAND-tree test
A NAND tree is provided in the NE1619 for Automated Test
Equipment (ATE) board level connectivity testing. The device is
placed into NAND tree test mode by powering up with Pin 9
(D–/NTEST_IN) held high. In this test mode Pin 16
(A0/RESET/NTEST_OUT) becomes the NAND-tree output and all
input pins become NAND-tree inputs as illustrated in Figure 12.
Table 9. NAND-tree test vectors
2004 Oct 05
HECETA4 Temperature and voltage monitor
SDA
VECTOR #
1
2
3
4
5
6
7
8
SCL
SDA
H
L
L
L
L
L
L
L
VID0
SCL
H
H
L
L
L
L
L
L
Figure 12. NAND-tree circuitry
VID0
VID1
H
H
H
L
L
L
L
L
VID1
14
H
H
H
H
L
L
L
L
VID2
To perform a NAND tree test all pins should be initially driven low.
Then one-by-one toggle them high (and keep them high), starting
with the input closest to the output, cycling toward the farthest, the
NAND tree output will toggle with each input change.
VID2
H
H
H
H
H
L
L
L
VID3
VID3
H
H
H
H
H
H
L
L
VID4
VID4
H
H
H
H
H
H
H
L
NTEST_OUT
Product data sheet
NE1619
NTEST_OUT
H
H
H
H
L
L
L
L
SL01232

Related parts for NE1619DS