UJA1075TW/5V0/WD,1 NXP Semiconductors, UJA1075TW/5V0/WD,1 Datasheet - Page 31
UJA1075TW/5V0/WD,1
Manufacturer Part Number
UJA1075TW/5V0/WD,1
Description
IC SBC CAN/LIN HS 5V 32HTSSOP
Manufacturer
NXP Semiconductors
Datasheet
1.UJA1075TW5V0118.pdf
(53 pages)
Specifications of UJA1075TW/5V0/WD,1
Controller Type
System Basis Chip
Interface
CAN, LIN
Voltage - Supply
4.5 V ~ 28 V
Current - Supply
83µA
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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NXP Semiconductors
UJA1075_2
Product data sheet
Table 9.
[1]
[2]
Symbol
R
Fig 14. HTSSOP32 thermal resistance junction to ambient as a function of PCB copper
th(j-a)
According to JEDEC JESD51-2 and JESD51-3 at natural convection on 1s board.
According to JEDEC JESD51-2, JESD51-5 and JESD51-7 at natural convection on 2s2p board. Board with
two inner copper layers (thickness: 35 μm) and thermal via array under the exposed pad connected to the
first inner copper layer.
R
(K/W)
th(j-a)
90
70
50
30
area
Parameter
thermal resistance from junction to
ambient
Thermal characteristics
0
with heatsink top layer
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 27 May 2010
2
without heatsink top layer
4
High-speed CAN/LIN core system basis chip
Conditions
single-layer board
four-layer board
6
PCB Cu heatsink area (cm
8
UJA1075
015aaa138
© NXP B.V. 2010. All rights reserved.
2
[1]
[2]
)
Typ
78
39
10
Unit
K/W
K/W
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