TDA8026ET/C2,557 NXP Semiconductors, TDA8026ET/C2,557 Datasheet - Page 32
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
TDA8026ET/C2,557
Manufacturer Part Number
TDA8026ET/C2,557
Description
IC SMART CARD SLOT 64TFBGA
Manufacturer
NXP Semiconductors
Datasheet
1.TDA8026ETC2518.pdf
(59 pages)
Specifications of TDA8026ET/C2,557
Controller Type
Smart Card Interface
Interface
I²C
Voltage - Supply
2.7 V ~ 5.5 V
Current - Supply
210mA
Operating Temperature
-25°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
64-TFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TDA8026ET/C2,557
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
TDA8026_1
Product data sheet
8.6 DC-to-DC converter
8.7 V
8.8 Sequencer and clock counter
The DC-to-DC converter has been designed to provide an average of 5.4 V to the
programmable voltage regulators (5 V, 3 V and 1.8 V) for the card slots. It is capable of
delivering a total DC current of 116 mA to the card slots.
If the total current from all card slots exceeds 170 mA, the overcurrent/overload protection
deactivates the DC-to-DC converter. The addition of a 10 H external coil and Schottky
diode ensures the DC-to-DC converter operates at an input voltage range between 2.7 V
and 5.5 V.
When the DC-to-DC converter cannot act as a step-up converter, an overload alarm is
sent to the digital module and all card slot interfaces are deactivated. This causes the
IRQN line to be driven LOW and the Bank 1 Register 0 PROT bit is set to logic 1.
The DC-to-DC converter is deactivated when the TDA8026 is in shutdown mode.
The card slots can be directly supplied by the V
5.25 V, thus removing the need to use the DC-to-DC converter. In this situation, the supply
voltage can be directly applied to the V
When DCDC_OFF is set to V
The current on the V
is reached, the automatic deactivation sequence is performed. Each card slot has its own
limitation and deactivation of one card slot does not affect the other card slots.
The V
One capacitor should be placed close to the V
the C1 pin of the card connector. See
Each card slot has a dedicated sequencer and clock counter.
The sequencer ensures that the activation and deactivation sequences meet the
ISO 7816 and EMV 4.2 standards, even during an emergency deactivation caused by
card removal during transaction, supply drop out or a hardware problem. The sequencer
is clocked with an internal oscillator (f
Fig 9.
•
•
CC
the output power transistors are switched OFF
the DC-to-DC converter current consumption is 0 A.
buffer
CC(n)
The DC-to-DC converter
voltage should be decoupled with two low ESR 100 nF (minimum) capacitors.
All information provided in this document is subject to legal disclaimers.
V
DD(INTF)
CC
buffer is internally limited to approximately 100 mA. When this limit
Rev. 1 — 9 March 2010
DCDC_OFF
V
V
DD(INTF)
DD(INTF)
DD(INTF)
DC-to-DC CONVERTER
, the DC-to-DC converter is shutdown:
osc(int)
Figure 14
UP
V
DD
and LX pins as shown in
).
V
> 5.25 V
DD
CC
DD
for detailed information.
pin of the device and the other close to
LX
supply voltage, if it is always above
Multiple smart card slot interface IC
V
GNDP
UP
001aal090
Figure
10 F
TDA8026
© NXP B.V. 2010. All rights reserved.
9.
32 of 59